- Pixelplus Introduces Image Recognition SoC
Pixelplus, a leading fabless semiconductor company in Korea that designs, develops and markets CMOS image sensors for various consumer electronics applications, today unveiled the PM1001, the Company’s new image recognition System-On-A-Chip (SoC).
- AeroAstro Acquires Signal Research Corporation (SRC)
AeroAstro, a microsatellite technology and communications pioneer, announced that it has acquired the majority of the assets of Signal Research Corporation (SRC), a Colorado-based provider of unique, high-value intelligence and space solutions. The acquisition extends AeroAstro’s capabilities into space-based payloads, radios, communications, signal detection and space systems.
- National Semiconductor Unveils .4 mm-pitch Boomer Audio Amplifiers
National Semiconductor today introduced two Boomer(R) Class AB amplifiers in a 0.4 mm-pitch package, the world’s smallest micro SMD package. The LM4941 1.25W audio amplifier and LM4985 stereo headphone amplifier provide low quiescent current and high output power, extending battery life in portable electronic devices, MP3 players, mobile phones and other similar applications.
- Texas Instruments Offers Power Supply Design Seminars
Building on more than 25 years of educating power supply designers with innovative design concepts, Texas Instruments (TI) has announced the North America schedule for its 2006 Power Supply Design Seminar Series. TI’s leading power management gurus will conduct a series of one-day seminars in 35 cities in the United States and Canada beginning September 13.
- Altera, Sarance, Cortina Team on Interlaken Protocol IP Core for FPGAs
Altera, design services provider Sarance Technologies and communications semiconductor specialist Cortina Systems today announced the availability of the industry’s first FPGA-based Interlaken intellectual property core to speed design of network systems applying the Interlaken protocol.
- SafeNet Rolls Out Sentinel RMSe for Embedded Systems
SafeNet, setting the standard for information security, launched the Sentinel RMSe, the only feature control and licensing solution designed specifically for embedded systems. Sentinel RMSe allows embedded systems vendors to increase profitability by pricing, packaging, and managing the software that powers their embedded devices according to market needs.
- Freescale Selects EDA Tools from Mentor Graphics
Mentor Graphics will supply Freescale Semiconductor with select EDA technologies designed to enhance the manufacturability and testability of semiconductors. Mentor plans to provide EDA tools in several focused areas of the nanometer chip design flow.
- L-3 Communications Acquires Nova Engineering
L-3 Communications announced today that it has agreed to acquire Nova Engineering (Nova) for $45 million in cash, plus an additional purchase price not to exceed $10 million that is contingent upon Nova’s future financial performance. The business is expected to generate annual sales of approximately $40 million for the year ending December 31, 2007, and will be included in L-3′s Command, Control, Communications, Intelligence, Surveillance and Reconnaissance (C3ISR) reportable segment.
- ABI Research Reduces RFID Market Forecast by 15%
ABI Research announced that it has reduced its 2007 market forecast for RFID software and services revenue to $3.1 billion, which represents a downward adjustment of approximately 15% from the firm’s previous estimates.
- Cypress Clock Generator Supports Cell Processor Architecture
Cypress Semiconductor, a world leader in timing-technology solutions, has introduced a clock generator specifically developed to provide the high performance clock signals required for both the Rambus XDR(TM) (Extreme Data Rate) memory systems and the FlexIO(TM) processor bus interface supporting applications that employ the new Cell processor architecture.
- Conflict Between Thermal and SI/EMC PCB Design Requirements
Software simulation company Flomerics has released a new survey highlighting the conflict that often occurs between meeting thermal, electromagnetic compatibility (EMC) and signal integrity (SI) design requirements in the development of new PCB designs. 59% of recipients agreed that thermal and EMC requirements are usually in conflict in PCB design while only 23% disagreed. An even higher 60% agreed that thermal and signal integrity requirements are usually in conflict in PCB design while 23% disagreed.