Ralink is a global leader in 802.11x chipset solutions for wireless communications. Their products are field-proven to deliver superior throughput, extended range, low-power consumption and consistent reliability for today's Wi-Fi, mobile and embedded applications. Each Ralink chipset provides a comprehensive feature set, a high level of chip integration and compliance with key IEEE and Wi-Fi standards. Ralink patented MIMO technologies provide a flexible path for continuous innovation across draft IEEE 802.11n, 802.11 a/b/g and b/g standards.
Ralink technology is field-proven with more than 45 million chipsets delivered to manufacturers of PC networking, mobile/handheld and digital multimedia applications worldwide. Ralink is recognized for superior performance and a comprehensive feature set that meets current and emerging Wi-Fi standards. We provide solutions for miniPCI, PCI, CB, USB and PCIe interfaces with 2.4 and 2.4/5 GHz support. Each Ralink chipset features two highly integrated IC's – RFIC and BB/MAC IC – which are fully compliant with draft IEEE 802.11n and 802.11a/b/g/ and b/g standards.
Ralink's Optimized RF Architecture and baseband algorithms provide superior performance with low-power consumption and consistent reliability.
Ralink 802.11n chipsets deliver patented MIMObility(tm) technology with support for up to 300Mbps PHY and robust connections at extended range while mitigating dead spots. With MIMObility(tm), Wi-Fi applications can be extended from traditional PC networking to a wide range of digital multimedia and handheld devices. Greater interference resistance helps customers tailor wireless networking solutions for high-throughput and latency-sensitive applications such as IPTV, Video on Demand, Internet radio, Voice over IP, onling gaming and more. In current Ralink chipsets, MIMO XR(tm) (eXtended Range) employs multiple techniques – including frame aggregation, packet bursting and maximum ratio combining (MIMO-MRC) – to dramatically increase the throughput and range of wireless networking products.
Ralink manufacturing makes use of both standard CMOS and high-yield compound-semiconductor (SiGe) processing technologies. Working from our combined Taiwan and U.S. base of operations, we partner with independent foundries for IC fabrication, which enables us to focus on continuous innovation and cost-efficiencies that translate into customer value. Ralink's primary silicon foundries are Taiwan Semiconductor Manufacturing Corp. (TSMC) and United Microelectronics Corp. (UMC).
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