picoChip was founded in 2000 to provide solutions to the challenges of the next generation of wireless systems: cost, development time and flexibility. To do this requires a team with world leading expertise in silicon design, software and systems, and picoChip has built this team in Bath in the UK, China and the USA.

The technology at the heart of picoChip is the picoArray, an array of fully-programmable processing elements which is optimized for high-performance signal processing, delivering ten-times better performance-per-Dollar than legacy systems, in an easy to program way. picoChip provides a full development environment for picoArray including a complete tool-chain, libraries and Software Reference Designs which are complete, conformance-tested implementations of major wireless communications standards.

The first silicon array, the PC101 which sampled in December 2002, demonstrated the capabilities of picoChip's technology and was integrated into a number of wireless products including the Willtek 4400 series mobile phone test system. The second generation device, the PC102, sampled in the third quarter of 2004 and is now in volume production, delivers world-beating price/performance for reconfigurable wireless signal processing. The PC102 has achieved significant design wins with major companies developing UMTS and WiMAX infrastructure systems.

The latest offering from picoChip is the PC20x family, The PC202, PC203 and PC205 are the first devices in the range, and are highly integrated, high-performance and extremely cost-effective DSPs. While the three devices each have different performance and features, they all integrate around 200 or more individual processors onto each die and deliver over 100GIPs and 25GMACs - dramatically better performance than legacy single-core DSPs. The processors are suitable for products ranging from wireless modems (CPE), through access points and picocells up to the most sophisticated next-generation macrocell basestations with MIMO.

picoChip's architecture is ideally suited to the new challenges of the wireless market: combining flexibility, ease of development and cost-efficiency for the most demanding air-interfaces.

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