The Virtual Stepper System (VSSTM) demonstrates high sensitivity and good accuracy to measure critical dimension (CD) variations and is capable of accurately predicting how CD variations are transferred into silicon. This technology can be fine tuned to acquire images through on-line or off-line inspection systems and provides very consistent, accurate results. VSS a proven technology for evaluating mask defect printability can be applied to reticle quality control and provide data on CD variations, corner rounding, and edge roughness.
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