Hot Swap Capability for Telecom Apps

The interoperability specifications developed by the Enterprise Computing Telephony Forum (ECTF) allow for a new class of high density computer telephony (CT) resource boards. An important feature of CT resource boards for the telecommunications industry is the ability to repair or reconfigure systems without power cycling or rebooting the operating system. Two new standards developed by the PCI Industrial Computer Manufacturers Group (PICMG) establish the functionality of a high density CT bus on 6U CompactPCI boards and add hot swap capability for both the CT and CompactPCI buses. In order to implement these specifications, it is important to understand the specifications, the supporting technologies that exist today and new technologies in development. We will examine a design implementation of a CompactPCI telephony resource board, focusing on the design tradeoffs required to add hot swap capability to both bus interfaces.

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