IC Tools White Papers
- Aerial-Image Simulations of Soft and Phase Defects in 193-nm Lithography for 100-nm Node
- 100-nm Node Lithography With KrF
- Wafer Printability Simulation Accuracy Based on UV Optical Inspection Images of Reticle Defects
- Verifying the Correctness of Your Optical Proximity Correction Designs
- The Application of Alternating Phase-Shifting Masks to 140 nm Gate Patterning (II): Mask Design and Manufacturing Tolerances
- Methods Used to Streamline Data Preparation for Memory Products
- Mask manufacturability issues for sub-wavelength lithography
- Mask Quality (Control) Evaluation using the Virtual Stepper System (VSS)
- Mask Error Enhancement Factor (MEEF) metrology using automated scripts in CATS
- Lithography Process Calibration with Applications in Defect Printability Analysis
- Laser Proximity Correction for Advanced Mask Manufacturing
- Integrating CD and Lithographic Process Window analysis with Mask Data Preparation for Subwavelength ICs
- Further Developments in Distributed Hierarchical Processing
- Distributed Hierarchical Processing
- Compensation of Long-Range Process Effects on Photomasks by Design Data Correction
- Comparison of Binary Mask Defect Printability Analysis Using Virtual Stepper System and Aerial Image Microscope System
- Automated Defect Severity Analysis for Binary and Phase-Shift Mask (PSM) Defects
- Silicon-Level Physical Verification of SubWavelength Designs
- Scalable DP and Hybrid OPC Bridge Subwavelength Design-to-Silicon Chasm
- Practical Application of Full-Feature Alternating Phase-Shifting Technology for a Phase-Aware Standard-Cell Design Flow
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