9/8/2005 - Lattice Semiconductor Corporation (NASDAQ: LSCC) announced that Automated Packaging Systems has chosen the LatticeECTM FPGA in the design of a bridge board for its next generation bagging system, the Autobag AB 180 Bagger. The Lattice FPGA is used for glue logic and as an interface between I/O registers and the I/O board.
"Initially, our objective was simply to reduce the cost of the bridge board," said Bob Ferrante, Electronic Design Engineer at Automated Packaging. "The previous generation design used a Lattice CPLD (complex programmable logic device). With the pin count that would be needed for the new design, we knew we had to migrate either to a higher density CPLD or to an FPGA. With the cost of FPGAs decreasing, now we can take advantage of the higher functionality of an FPGA for the same cost as a CPLD. Using an FPGA also would allow us to replace several devices on the board and to integrate other functions into the FPGA, reducing total system cost."
Using the LatticeEC device made it possible to replace multiple devices, one a programmable logic device and the other a dual-UART device, by incorporating their functionality into the LatticeEC device. At the same time, non-volatile RAM and CAN control busses were integrated into the Lattice device as well as incorporating Intellectual Property (IP) cores from Lattice partners. "Our design not only was less expensive than the previous one, it had more functionality and saved board space," said Ferrante. "Not a bad day's work."
FPGAs from the major suppliers were evaluated. "In fact, we had just about settled on another device when the LatticeEC device became available," said Ferrante. "The Lattice product provided density migration so the footprint wouldn't change even if design changes required we switch from one part to another. Access to low cost, off the shelf SPI Flash PROMs for configuration also was very attractive. And because we have to reprogram the design on the fly, the ease of field upgrades was very important. Also, because we'd used Lattice CPLDs in the past, we were familiar with the design tool software, and we knew the local support would continue to be outstanding."
"Our LatticeEC and LatticeECPTM FPGAs are being adopted widely across multiple applications and markets, and continue to establish themselves as the low cost FPGAs of choice," said Stan Kopec, Lattice vice president of corporate marketing. "As the experience of Automated Packaging demonstrates, our LatticeEC FPGAs deliver economy, integration and performance."
About the LatticeECP and LatticeEC FPGA Families
The LatticeECP and LatticeEC FPGA device families are architected to provide the most optimized feature sets combined with the lowest total solution costs of any FPGAs. The new LatticeECP-DSPTM products, targeted for high-performance DSP applications, provide up to a 50% performance and 75% logic utilization improvement over other low cost solutions when implementing common DSP functions. The LatticeEC FPGA product family, targeted for general-purpose FPGA applications, is a precise and targeted response to the market's explosive demand for low cost, architecturally streamlined logic solutions. Through advanced 130nm silicon technology, an optimized architecture and proprietary circuit design, the new Lattice devices lower total solution costs by up to 30% to 50% compared with existing FPGA solutions, and are expected to broaden the adoption of FPGAs within the $20 billion ASIC marketplace.
About Automated Packaging Systems
Automated Packaging Systems is the only company that manufactures the original, genuine Autobag® pre-opened bags-on-a-roll. We are larger than all of our pre-opened bags-on-a-roll competitors combined and have provided unmatched service to our customers since 1962. With over 25,000 machines in operation and nationwide field service, we are the only company that can truly provide a total systems approach for your needs. With our in-house engineering and art departments, we can provide you with custom designed machinery and bag design. We also sell many standard "off the shelf" models of machines. We listen to determine what your needs are and work in concert with you to determine the best solution. Our dedicated workforce cannot be matched. Over 25% of our employees have over 20 years of service to Automated Packaging Systems. Many of our distributors and representatives also have over 20 years experience with the company and many are former employees.
About Lattice Semiconductor
Lattice Semiconductor Corporation provides the industry's broadest range of Field Programmable Gate Arrays (FPGA) and Programmable Logic Devices (PLD), including Field Programmable System Chips (FPSC), Complex Programmable Logic Devices (CPLD), Programmable Mixed-Signal Products (ispPAC®) and Programmable Digital Interconnect Devices (ispGDX®). Lattice also offers industry leading SERDES products.
Lattice is "Bringing the Best Together" with comprehensive solutions for system design, including an unequaled portfolio of non-volatile programmable devices that deliver instant-on operation, security and "single chip solution" space savings. Lattice products are sold worldwide through an extensive network of independent sales representatives and distributors, primarily to OEM customers in communications, computing, industrial, consumer, automotive, medical and military end markets. Company headquarters are located at 5555 NE Moore Court, Hillsboro, Oregon 97124-6421, USA; telephone 503-268-8000, fax 503-268-8037.
Lattice Semiconductor Corporation, Lattice (& design), L (& design), ispGDX, ispPAC, LatticeEC, LatticeECP, LatticeECP-DSP and specific product designations are either registered trademarks or trademarks of Lattice Semiconductor Corporation or its subsidiaries in the United States and/or other countries.
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