5/2/2005 - RadiSys Corp. (Nasdaq: RSYS), a leading supplier of advanced embedded systems, announced D. Ross MacLeod has been named vice president of engineering. MacLeod has over 20 years of technology and global R&D expertise, most recently with Nortel. He has held a wide range of executive and senior management positions in R&D, operations and product management and has been responsible for leading global operations and R&D efforts in Europe, Asia and North America. While with Nortel, MacLeod was responsible for the company’s main product R&D lab in China, and managed the multi-national wireless 3G R&D program from Nortel’s labs outside Paris, France. He replaces Ron Dilbeck, who retired from RadiSys earlier this month.
“Ross has broad R&D leadership experience and a proven track record of bringing new, leading edge products to market that meet customer needs,” said Scott Grout, RadiSys president and CEO. “This combination along with his broad hardware, software and system expertise make him the ideal leader to build on the success of our engineering team.”
“I am pleased to be part of a company that plays such an important role in the development of next generation embedded platforms,” said MacLeod. “RadiSys has been at the forefront of delivering standards-based, application-ready platforms that allow their customers to meet tight time-to-market schedules and manage even tighter budgets.”
During his career with Nortel, MacLeod was charged with leading the R&D efforts of several strategic programs. He was often asked to create and/or develop R&D labs in various locations around the globe, always with a focus on improving capabilities in the timely delivery of quality products. Prior to Nortel, MacLeod spent 11 years with Bell-Northern Research, initially as a developer and, then in progressively more senior management positions, developing leading embedded technology solutions. MacLeod also spent three years with Arthur Anderson Consulting as a senior information systems consultant.
MacLeod is a graduate of Carleton University in Ottawa, Canada and during his career has received several awards for outstanding performance including, Nortel Networks’ Platinum Talent and Vice President’s Awards for Innovation as well as a Bell-Northern Research Award of Excellence for Process Innovation.
RadiSys (Nasdaq: RSYS) is the leading provider of advanced embedded solutions for the commercial, enterprise, and service provider systems markets. Through intimate customer collaboration and combining innovative technologies and industry leading architecture, RadiSys helps OEMs bring better products to market faster and more economically. RadiSys products include embedded boards, platforms and systems, which are used in today's complex computing, processing and network intensive applications.
RadiSys is a premier member of the Intel® Communications Alliance (ICA). The Intel Communications Alliance is a member-based program comprised of communications and embedded developers and solution providers. Members are committed to providing a strategic supply of standards-based solutions to the communications and embedded market segments. For more information, please visit www.intel.com/go/ica.
Promentum and Procelerant are trademarks and RadiSys and EPC are registered trademarks of RadiSys Corporation.
For more information, contact RadiSys at email@example.com
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