2/25/2005 - RadiSys Corp. (Nasdaq: RSYS) announced the RadiSys ProcelerantTM CE, the first in a family of products based on COM Express*, the new PICMG® (PCI Industrial Computer Manufacturers Group) standard for PCI ExpressTM in Computer-on-Modules (COMs). The Procelerant CE consists of a carrier board and four COM modules and is one of the industry’s first off-the-shelf, COM Express-compliant, ultra small form factor computing systems. The Procelerant CE was designed for use in a medical, test and measurement and industrial control applications.
OEMs (original equipment manufacturers) who manufacture products ranging from small handheld devices to large free standing systems are faced with application demands that exceed current processor module capability. Additionally, the embedded processor module market is fragmented with many custom solutions and lacks universally accepted standards. Meeting time-to-market demands, maintaining development costs and managing supply chains in this environment is a huge challenge. Incorporating Procelerant CE into their designs and relying on RadiSys to manage supply chain functions, customers can design better products faster and more economically.
“RadiSys designed the Procelerant CE to help OEMs lower product lifecycle costs and respond to market changes faster. This is made possible by offering a scalable, interchangeable platform equipped with the latest processor, chipset and memory features,” said Wade Clowes, general manager, Commercial Segment, at RadiSys. “By incorporating the Procelerant CE into their designs OEMs no longer need to search for the right board with the right features. They can reuse the architecture across several products resulting in a reduction in the number of processor boards needed to create an entire product line.”
The Procelerant CE is made up of standard multiple COMs and a carrier development board. Customers can choose the appropriate COM (based on Intel® Pentium® -M, Intel® Celeron® -M processors and Intel® 915GM Express chipset) depending on their compute processing needs. Incorporating the Procelerant CE into designs allows design teams to optimize development budgets and increase productivity by using a common architecture across several product lines. Organizations can also accelerate their design process by developing software on the COM and carrier, while designing the rest of their system in parallel. Once in the field, application performance upgrades can be made by simply upgrading the COM.
“RadiSys played a key role in developing the COM Express standard,” said Doug Davis, vice president, Digital Enterprise Group, general manager, Infrastructure Processor Division, Intel Corporation. “This work with key industry players combined with Radisys’ embedded platforms based on the latest Intel® products can significantly lower customers’ time to market.”
Procelerant CE gives organizations configuration flexibility and provides a smooth migration path from legacy to new technology as necessary. For example, the module provides key legacy and new technology interfaces that enable migration from PCI to PCI Express, IDE to SATA, or 10/100 megabit to 1 Gigabit Ethernet all using the same module. This gives customers the flexibility to upgrade and refresh different product lines with new interface technologies at different rates all while using a common COM. The ability to easily configure different price/performance points with the range of COM modules provides further flexibility to build a range of product models all from the same family of standard COMs. Unlike single processor boards, Procelerant CE allows users to easily change configurations as applications and processors evolve. Additionally, software becomes portable and can be used from module to module and application to application. This commonality and flexibility across product lines allows OEMs to experience faster design cycles and respond to customer demands quicker.
In addition to announcing the Procelerant family of COM Express-compliant products, the company is expanding its RadiSys Alliance Program (RAP) to include OEM partners. Through RAP, RadiSys collaborates with industry leaders to ensure customers developing next generation medical, test & measurement and industrial control applications have ready access to quick design alternatives that help them meet time-to-market requirements and optimize their design budgets.
About The RadiSys Procelerant CE
The Procelerant CE consists of four COM Express modules and a carrier card. The module is 90mm x 125mm in size and is based on the Intel Pentium -M processor and Intel 915GM Express chipset. The CE760, CE738, CE370 and CE373 COMs are based on the respective Intel processors, the 2.0GHz Intel® Pentium® -M 760, the 1.4GHz Intel® Pentium® -M 738, the 1.5GHz Intel® Celeron® -M 370, and the 1.0GHz ULV Intel® Celeron® -M 373. The modules feature up to 1 GB DDR2 DRAM and include dual display (analog VGA, LVDS and SDVO interface), AC97/Azalia audio interface, Gigabit Ethernet, PCI Express and PCI support. The carrier board is a FlexATX form factor featuring x16 PCI Express, or dual DVI and SVGA capability. The board also includes a x1 PCI Express slot and PCI Express Mini Card slot, 2 PCI slots, LVDS display, (4) SATA interfaces, IDE interface, GPIO header, quad USB connection capability, Gigabit Ethernet, I2C EEPROM, RS232 header and AC97 jacks.
The RadiSys CE will be available in July 2005. Pricing starts at $489 in small quantities. For more information, please contact RadiSys at 800 950 0044.
RadiSys (Nasdaq: RSYS) is the leading provider of advanced embedded solutions for the commercial, enterprise, and service provider systems markets. Through intimate customer collaboration and combining innovative technologies and industry leading architecture, RadiSys helps OEMs bring better products to market faster and more economically. RadiSys products include embedded boards, platforms and systems, which are used in today's complex computing, processing and network intensive applications.
RadiSys is a premier member of the Intel® Communications Alliance (ICA). The Intel Communications Alliance is a member-based program comprised of communications and embedded developers and solution providers. Members are committed to providing a strategic supply of standards-based solutions to the communications and embedded market segments. For more information, please visit www.intel.com/go/ica.
Promentum and Procelerant are trademarks and RadiSys and EPC are registered trademarks of RadiSys Corporation. *All other products are trademarks or registered trademarks of their respective companies.
For more information, contact RadiSys at email@example.com or call 800-950-0044 or 503-615-1100.
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