2/25/2005 - RadiSys Corp. (Nasdaq: RSYS) announced five new products in its ProcelerantTM family of embedded platforms. The Procelerant portfolio includes system-level platforms and individual building blocks all designed to help customers develop better products faster and more economically. The RadiSys ProcelerantTM CE is the first in a series of COM Express*-compliant products. The company also adds four new ProcelerantTM Endura motherboards to its product lineup. With these additions RadiSys offers a broad range of solutions for OEMs developing next generation medical equipment, test & measurement systems, transaction terminals and industrial control equipment.
The Procelerant CE is one of the industry’s first platforms based on COM Express, the new PICMG® (PCI Industrial Computer Manufacturers Group) standard for PCI ExpressTM in Computer-on-Modules (COMs). The Procelerant Endura motherboards are one of the industry’s first to support the latest Mobile Intel® 915GM Express chipset.
“Our strategy is to deliver standards-based, fully integrated, application-ready embedded platforms that allow customers to focus their resources on developing features that differentiate their products,” said Wade Clowes, and general manager, Commercial Segment at RadiSys. “Rounding out our portfolio with COM Express-compliant products and adding new long life motherboards that support the latest Intel® chipsets is further proof of our commitment to meet customer’s current and future needs.”
Today RadiSys offers products based on a variety of standard form factors including AdvancedTCA®, COM Express, CompactPCI, PrPMC, PCI, ATX, and uATX. This ensures OEMs who are designing embedded products, from handheld devices to large free standing systems, are guaranteed a platform that meets their requirements whether they need scalable, long life/low power motherboards or small compute platforms that can be leveraged across a variety of products.
“RadiSys played a key role in developing the COM Express standard,” said Doug Davis, vice president, Digital Enterprise Group, general manager, Infrastructure Processor Division, Intel Corporation. “This work with key industry players combined with Radisys’ embedded platforms based on the latest Intel® products can significantly lower customers’ time to market.”
RadiSys (Nasdaq: RSYS) is the leading provider of advanced embedded solutions for the commercial, enterprise, and service provider systems markets. Through intimate customer collaboration and combining innovative technologies and industry leading architecture, RadiSys helps OEMs bring better products to market faster and more economically. RadiSys products include embedded boards, platforms and systems, which are used in today's complex computing, processing and network intensive applications.
RadiSys is a premier member of the Intel® Communications Alliance (ICA). The Intel Communications Alliance is a member-based program comprised of communications and embedded developers and solution providers. Members are committed to providing a strategic supply of standards-based solutions to the communications and embedded market segments. For more information, please visit www.intel.com/go/ica.
Promentum and Procelerant are trademarks and RadiSys and EPC are registered trademarks of RadiSys Corporation. *All other products are trademarks or registered trademarks of their respective companies.
For more information, contact RadiSys at firstname.lastname@example.org or call 800-950-0044 or 503-615-1100.
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