Texas Instrument Leads Industry with Launch of First RapidIO DSP

2/15/2005 - The RapidIO Trade Association (RTA), a membership-based organization dedicated to driving the RapidIO interconnect architecture (www.RapidIO.org), cited Texas Instruments' launch of the TMS320TCI6482, the first RapidIO DSP, as an indicator that market leaders are on track to deliver a wide range of RapidIO products throughout 2005.

"Texas Instruments epitomizes the high quality of the companies and individuals comprising the RapidIO ecosystem, a talented team of market leaders and experts dedicated to making a tangible investment in delivering RapidIO-based products to market," said Iain Scott, executive director of the RapidIO Trade Association. "The TMS320TCI6482 is an important component that facilitates higher speed interconnectivity and more reliable performance in the design of advanced communications systems."

The TMS320TCI6482 device supports four serial 1x links that can be combined to form a single 4x link, allowing connectivity to multiple RapidIO enabled devices or to one high bandwidth RapidIO device. Link data rates supported on this device are 1.25, 2.5 and 3.125 Gbaud, effectively allowing scaleable data bandwidth from 1 Gbps to 10 Gbps. Built on TI's industry leading 90nm process, the TCI6482's unique combination of high performance and low power make it the most power efficient DSP for wireless infrastructure systems. In addition, the device supports logical layer messaging as well as IO accesses. Messaging features built into TI's DSP BIOS operating system eases communication between DSPs and other processors. RapidIO's hardware-based error handling techniques ensure systems-level reliability through advanced failure management.

The RapidIO Interconnect Architecture, the only open standard designed specifically for embedded applications, is compatible with the most popular integrated communications processors, host processors, and networking digital signal processors, is a high-performance, packet-switched, interconnect technology. It addresses the high-performance embedded industry's need for reliability, increased bandwidth, and faster bus speeds in an intra-system interconnect. The RapidIO interconnect allows chip-to-chip and board-to-board communications at performance levels scaling to 10 Gigabits per second and beyond.

Designed specifically to achieve high-performance, low-cost, reliable and scalable system connectivity in embedded, networking, and communications devices, the RapidIO specification is being embraced by communications systems OEMs, computer systems manufacturers and silicon vendors around the world.

About The RapidIO Trade Association
The RapidIO Trade Association and its global members drive the RapidIO. interconnect architecture. This ISO-certified, open-standard seamlessly enables the chip-to-chip, board-to-board, control, backplane and data plane interconnections needed in high-performance networking, communications and embedded systems. RapidIO-based products are shipping now, including silicon chips, boards and systems. Detailed information on the RapidIO specification, products, design tools, member companies, and membership is available at www.RapidIO.org.

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