8/13/2004 - Tundra Semiconductor (TSX:TUN), the leader in System Interconnect, announced the availability of lead-free and green packaging options for the majority of its System Interconnect product portfolio.
Tundra has joined the worldwide move by the electronics industry to reduce the level of harmful materials in electronic components and systems. The new lead-free and green packaging options will use substitute materials for hazardous substances currently in use. In addition to the products currently in production, all future Tundra products will be offered in lead-free and green packages. Tundra used the European Union's Restriction of Hazardous Substances (RoHS) legislation as well as initiatives in the Japanese market as guidelines for the new packaging options.
"Tundra is committed to delivering products that our customers value," said David Lisk, Vice President, Operations at Tundra. "We share our customer concerns and their desire to be environmentally friendly. We are pleased to offer these product options."
The Tundra lead-free program gives customers the choices of lead-free and green packaging options well ahead of the deadline of July 1, 2006 imposed by the European Union. For more information about the Tundra lead-free program and product options visit www.tundra.com/Products/LeadFree.cfm
Lead-free and Green Package terminology
A lead-free product contains less than 0.1% lead (Pb) by weight. It also uses substitute materials for the following additional hazardous substances: Mercury, Cadmium, Hexavalent Chromium, and Fire Retardants PBB and PBDE. A green product additionally offers substitute materials for other potentially hazardous substances not listed in EU legislation (Halogens and Antimony). All of Tundra's lead-free and green products are RoHS compliant.
About European Union Legislation
RoHS is the European Union legislation covering the restriction of the use of certain hazardous substances in electrical and electronic equipment.
Tundra Semiconductor Corporation designs, develops, and markets standards-based System Interconnect for use by the world's leading communications and storage system companies. Tundra supports RapidIO, VME, PCI standards. Tundra System Interconnect is a vital communications technology that enables customers to connect critical system components while compressing development cycles and maximizing performance. Applications include wireless infrastructure, storage networking, network access, military applications, and industrial automation. Tundra headquarters are located in Ottawa, Ontario, Canada. The Company also has a design center in South Portland, Maine, and sales offices in the U.K., across the US and in Asia. Tundra sells its products worldwide through a network of direct sales personnel, independent distributors and manufacturers' representatives. Tundra employs about 200 employees worldwide.
TUNDRA is a registered trademark of Tundra Semiconductor Corporation (Canada, U.S. and U.K.). TUNDRA, the Tundra logo, and Design. Connect. Go. are trademarks of Tundra Semiconductor Corporation.
Tundra Semiconductor Corporation
603 March Road
Ottawa, ON, Canada K2K 2M5
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