Summit Offers Products with Lead-Free and Green Options

7/6/2004 - Summit Microelectronics has added "lead-free" and "green" options to its product offerings. "Lead free" is an industry-standard term referring to products with no lead added to the plating on the package pins - Summit guarantees less than 900 parts per million lead on the package pins.

"Green" is an industry-standard term referring to products with neither antimony nor halogen flame retardant added to the mold compound - Summit guarantees the total to be less than 900 parts per million.

Summit is offering products that are lead-free, or green, or both as options in each of its standard packages - TQFP, QFN, SOIC, SSOP and Ultra CSP. All are offered without cost adder over standard product.

The Summit product option that is both lead-free and green passes Europe's "ROHS" (Reduction of Hazardous Substances) standard.

More information about Summit's Lead-Free and Green products can be found at

Summit Microelectronics supplies semiconductors that manage power functions in networking/communications, storage/computing, industrial, military and consumer products. Customers can very rapidly tailor Summit's programmable analog technology to multiple applications by programming the same part. Founded in 1997, Summit is headquartered in San Jose, California. The Company is ISO 9001 certified.

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