Ironwood Electronics Unveils SS-BGA676C-01 Small Footprint Socket

6/11/2004 - Ironwood Electronics is introducing the SS-BGA676C-01 small footprint socket compatible with ICís such as the Xilinx FG676. The SS-BGA676C-01 accommodates BGA ICís with a 27mm body, 26X26 array, and 1.0mm pitch.

The contactor is a spring pin (pogo) with 30 gram actuation force per ball and cycle life of 500,000 insertions. The self inductance of the contactor is 0.62 nH with a loss of < 1 dB at 10 GHz. The current capacity of each contactor is 4 amps at ambient temperature. Socket temperature range is -40C to +150C. The socket is mounted to the PCB with a backing plate and requires only 2.54mm border around the IC.

The Socket is constructed of aluminum which provides heatsinking up to 7.5 watts. Custom heatsinks can easily be designed for higher power dissipation. The user simply places the IC into the socket, closes the lid, and rotates the heatsink screw to seat the IC. The SS-BGA676C-01 is footprint compatible with the Ironwood Electronics SG-BGA-6009 elastomer based socket providing a range of solutions. PCB finish on pads can be HASL, Immersion, Au, Immersion Ag, or tin. The SS-BGA676C-01 is a member of a family of sockets providing small footprint high endurance socketing for 1.0 and 1.27mm pitch BGA ICís.

The SS-BGA676C-01 is available immediately. The cost is $3725.00 each at quantity 1.

Ironwood Electronics, Inc.
990 Lone Oak Rd., Suite 120
St. Paul, MN 55121
Tel: 651-452-8100 or (800) 404 Ė 0204
Fax: (651) 452 Ė 8400

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