6/9/2004 - Cypress Semiconductor Corp. (NYSE: CY) announced that it will offer lead-free packages for all new integrated circuit (IC) products by the end of the third quarter 2004. This initiative will be a major milestone in the company’s efforts to make its product packaging more environmentally friendly by using nickel-palladium-gold frame technology—an innovative technology that has been accepted by the market—to shift lead-based products to lead-free.
Shipping lead-free semiconductor products has been an industry initiative—driven by Europe and Japan—for many years. Since 2001, Cypress has been working with customers and the European Union’s Restriction of Hazardous Substances (RoHS) legislation on a multi-step, banned substance elimination program. In addition to eliminating lead, Cypress plans to meet the RoHS legislation requiring the elimination of many hazardous substances from its packaging in 2005. Cadmium, mercury and chromium are samples of banned substances on the RoHS produced list. After removing all of the RoHS banned substances, Cypress products will meet the RoHS definition of “Green.”
Cypress also received a “Green Partner” award from Sony in 2003, a program recognizing suppliers that have successfully implemented systems to reduce or eliminate harmful substances in its processes and products.
“Cypress shipped two-million lead-free products in the first quarter of 2004,” said Bob Blazer, vice president of assembly and test operations. “We strive to be one of the first companies in the semiconductor industry to offer 100 percent lead-free products. Also, in order to prevent the continued use of lead in the frame material, all new products in development are required to have lead-free availability.”
Blazer added, “Our goal is threefold: to create a solution that is environmentally friendly; fulfill our end-customer demands; and to create lead-free products that can be transitioned into our customer systems, easily. Our nickel-palladium-gold technology does all three.”
In order to help customers switch to lead-free devices, Cypress offers backwards-compatible packages that enable customers to make a simple transition from a lead-based to a lead-free product. Cypress is changing its internal process and materials from lead-based to nickel-palladium-gold based frames. Customers—whose future end-products must also be lead-free—have been qualifying Cypress products.
For more information on Cypress’s lead-free initiative, please visit the Cypress website at www.cypress.com/support/package/pbfree.cfm.
Cypress Semiconductor Corp. (NYSE: CY) is Connecting from Last Mile to First MileTM with high-performance solutions for personal, network access, enterprise, metro switch and core communications-system applications. Cypress ConnectsTM using wireless, wireline, digital, and optical transmission standards, including USB, Fibre Channel, SONET/SDH, Gigabit Ethernet and DWDM. Leveraging its process and system-level expertise, Cypress makes industry-leading physical layer devices, framers, and network search engines, along with a broad portfolio of high-bandwidth memories, timing technology solutions and reconfigurable mixed-signal arrays. More information about Cypress is accessible online at www.cypress.com.
Cypress and the Cypress logo are registered trademarks of Cypress Semiconductor Corporation. “Connecting from Last Mile to First Mile,” and “Cypress Connects” are trademarks of Cypress.
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