ERNI Targets IDC Systems with Through-Hole Reflow Pin Headers

5/10/2004 - Pin headers, based on the IEC 603-13 standard, are a popular solution for low-cost connections between printed circuit boards and interfaces. For intelligent processing of modern modules with SMT-compatible components, ERNI has now developed pin headers with through-hole reflow (THR) connections configured for IDC systems having a 2.54-mm (0.1-inch) pitch.

For fully automatic SMT processing, the new THR pin headers are available upon request with pick-and-place pads, and tape-on-reel packaging. Black insulating bodies ensure easy and reliable reflection-method camera detection. The specially shaped connector tips are ideally suited for THR, and ensure trouble-free placement of components on the circuit board. In addition, the insulating body is made of high-temperature-resistant thermoplastic, and can be processed with all conventional soldering processes, such as reflow or vapor-phase soldering.

Available in standard packaging
The THR pin headers, with a 2.54-mm (0.1-inch) pitch, are available in standard packaging with 10, 14, 16, 20, 26, 34, 40, 50, 60 or 64 pins. Each package contains 35 items. Short or long locking latches are also available as high-temperature-resistant thermoplastic accessories.

ERNI Elektroapparate GmbH, a German member company of the international ERNI Holding Group, was established in 1956 and is headquartered in Adelberg (near G?ppingen). ERNI develops and manufactures a wide variety of connectors for backplane and printed circuit board applications. The system technology business unit develops and produces customer-specific printed circuit board systems and backplanes. ERNI is a globally active enterprise with branch offices in Europe, North America and Asia. ERNI products are also marketed via a network of representatives and leading distributors. Further information is available at

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