4/28/2004 - Elma Electronic Inc., a global manufacturer of electronic packaging products, has expanded on its simulation and analysis capabilities with new Computational Fluid Dynamics software.
Geared for electronic packaging applications, the FlowTherm simulation and analysis software can import 3D models from the company's CAD engineering program. It can build conceptual 2D/3D models of enclosures and run preliminary simulations. With animation capabilities, the software can illustrate the airflow through an enclosure and scan the heat distribution and airflow on a slot-by-slot basis.
Elma will have the advanced simulation capabilities to identify potential hot spots in an enclosure and eliminate it by optimizing the size, location of fans, baffles, etc, during the design phase. The company will have the ability to perform multiple "what if " scenarios to arrive at the ideal design. These enhanced capabilities are particularly useful for the company's PICMG 3.0 AdvancedTCA product lines. As thermal management is a key parameter in AdvancedTCA, Elma has been able to optimize the chassis cooling techniques for several custom applications.
For more information on Elma's advanced simulation and analysis capabilities, call 510-656-3400 or visit www.elma.com.
About Elma Electronic
Elma Electronic Inc. is a leading manufacturer and supplier of enclosures, backplanes, cabinets, cases, and "ready-to-run" packaging for CPCI, Rugged COTS, VME/64x, VXI, PC and custom bus structures. Elma's component product line offers a wide selection of top quality switches knobs and LED arrays. The company has been a worldwide supplier of dependable, high performance products for over 35 years. Elma operates three facilities in the continental United States plus has locations in Switzerland, Germany, France, the United Kingdom and Israel.
Elma Electronic Inc. is located at 44350 Grimmer Blvd., Fremont, CA 94538 USA. Telephone (510) 656-3400 - Fax (510)656-3783. www.elma.com
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