3/10/2004 - Oki Semiconductor, a leading technology partner for the new era of digital communications and convergence, announced the availability of a unique fully qualified Wafer-level Chip Scale Package (W-CSP) solution for ASIC products. This high-performance, low-power, small form factor packaging alternative for ASIC designs responds to the growing market demand for smaller, more portable devices, such as cell phones, GPS systems, PCMCIA cards, wireless LANS and other mobile applications. Oki's ASIC W-CSP package answers the challenge for feature-rich ASIC solutions with powerful small form factor packaging, which incorporates high performance, is ultra-thin, and has a very small footprint.
With the miniaturization of a wide range of mobile telecommunications applications, engineers are struggling to find thinner and smaller chips to use in their small form factor designs. Moreover, designers are looking for low-power solutions that will provide increased performance and more capacity at a lower cost, but will consume less space on the board. In addition to the standard packages like QFP and BGA, Oki's fully qualified ASIC in a W-CSP package will provide designers with a thin package that's about the size of the silicon itself while keeping the ever growing functionality and features in an ASIC. Oki's W-CSP package is a mold resin type with thicknesses as small as 0.4 mm. It has the same or better reliability than the conventional packages. Target chip sizes for W-CSP applications are 2 x 2 mm to 8 x 8 mm with pin counts of up to 250 pins. For the same pin count, the size of a W-CSP is 50 percent of the fine pitch BGA and 25 percent of the fine pitch QFP package. The weight is one-fourth of BGA and one-tenth of QFP.
Oki, an industry-leader in W-CSP technology, is one of a few vendors that can provide a package that meets the latest ASIC performance and space requirements of designers developing small portable devices.
"In addition to its increased performance and small foot print, Oki's W-CSP is an ideal solution for ASIC designers because it provides them with a true SoC single chip solution for small form factor mobile applications that previously required several chips in low-pin count CSP packages to achieve their desired functionality. As a result, this solution will help designers reduce their overall system cost," said Anil Chaudhry, director, ASIC marketing, Oki Semiconductor.
Since the W-CSP market began in 2002, Oki has the largest market share in the Japanese market (80 percent of the mold resin type W-CSP market) and is a leader in offering a fully tested ASIC using this chip level packaging.
Benefits provided by Oki's W-CSP
Other Key Technical Features
Customers who want to design their ASICs with Oki's W-CSP packages can contact their nearest sales representative or distributor. A complete listing of Oki's nationwide network of sales representatives and distributors can be found on the Oki Semiconductor website at www.okisemi.com/us.
About Oki Semiconductor
Building on Oki's century-long commitment to communications technologies and markets, Oki Semiconductor designs and markets a broad line of advanced integrated circuits for telecommunications, network, automotive, computer and consumer products. Oki's product lines include telecommunications, RF, laser, networking, speech synthesis, ASIC, microcontroller and memory devices, offered in a variety of creative packages. Founded in 1977 and headquartered in Sunnyvale, Calif., Oki Semiconductor is a division of Oki America Inc., which is a subsidiary of Oki Electric Industry Co, Ltd. Oki has ISO-9000-certified manufacturing facilities in Japan and Thailand. Information on Oki Semiconductor and its products is available at www.okisemi.com/us.
Oki Semiconductor the Right Partner for a Digital WorldTM.
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