Agilent Targets GSM RF Front-end Modules with FBAR Filters

3/1/2004 - Agilent Technologies Inc. (NYSE: A) announced it is shipping samples of the industry's smallest filters to select manufacturers for integration into GSM RF front-end modules. Because of the small size and superior thermal performance of Agilent's film bulk acoustic resonators (FBARs), filters can now be incorporated into front-end modules, including transceiver modules. These high-performance FBAR products are on display at the Agilent booth here through Feb. 26.

"Our innovative Microcap packaging technology delivers miniature chip-scale FBAR filters that provide low temperature coefficient, small footprint and thinness perfectly suited for module integration," said Bryan Ingram, vice president and general manager of Agilent's Wireless Semiconductor Division. "The FBAR advantage has already resulted in more than 20 million units shipped, and now we're set to proliferate this filtering technology into RF front-end modules for the next generation of feature-rich mobile phones."

Agilent's FBAR filters use the company's Microcap bonded wafer chip-scale technology to create the industry's smallest RF filter. GSM transceiver and switch module manufacturers are attempting to reduce thickness from about 1.6 mm today to about 1.0 to 1.2 mm in the future. At 0.3 mm high, Agilent's bumped FBAR Microcap filters enable this reduction. In addition, with a temperature coefficient of -25 ppm/degree C, FBAR filters have only 60 percent the temperature sensitivity of surface acoustic wave (SAW) filters, making them a better choice for modules densely populated with heat sources such as transceivers or power amplifiers. The resulting thin, small, highly integrated modules accelerate time to market for handset manufacturers and make room for additional handset features, such as camera modules, GPS locators, and infrared and Bluetooth connectivity.

FBAR Filters vs. SAW Filters
Agilent's FBAR filters are built with the company's innovative Microcap bonded-wafer chip scale technology. This process produces the industry's smallest individually sealed filters in a bumped Microcap die. This breakthrough resonator technology is displacing ceramic dielectric filters and SAW filters. Key comparisons between FBAR filters and SAW filters include:

The new Microcap chip scale FBAR filters are shipping in prototype quantities to select module manufacturers. They are expected to ship in volume in Q3 2004.

Further information on Agilent's RF semiconductor products is available at

Agilent's Mobile Appliance Solutions
Agilent is a leading supplier of semiconductor solutions for today's highly integrated, feature-rich mobile handsets. In addition to FBAR filters and E-pHEMT power amplifiers that help shrink handset size and save battery life, Agilent provides embedded camera modules that enable camera phones with exceptional image quality, infrared transceivers for transmitting data, surface mount LEDs that provide backlighting styling options, and ambient light photo sensors that save battery life by controlling backlighting. No other component vendor offers all of these solutions for mobile appliances.

About Agilent Technologies
Agilent Technologies Inc. (NYSE: A) is a global technology leader in communications, electronics, life sciences and chemical analysis. The company's 28,000 employees serve customers in more than 110 countries. Agilent had net revenue of $6.1 billion in fiscal year 2003. Information about Agilent is available on the Web at

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