2/27/2004 - Fujitsu Microelectronics Europe announces a new Bluetooth® surface-mount type wireless technology module (version 1.1 compliant), ideally suited to embedded applications.
The MBH7BTZ03 features a small footprint of 10 x 9.5 x 1.9mm. It has a UART hardware interface, a high rank protocol stack (L2CAP, SDP, RFCOMM) and GAP, SPP & DUN profiles to reduce the burden on the host CPU. Users are able to choose between the Host Controller Interface (HCI) and the Serial Port Profile (SPP) interface. As the latter includes the upper level protocol stack for serial communication, this design allows significant savings in software development, reducing time to market and cost. The software interface is a simple text-based command control.
The Power Class 2 module operates in the 2.4GHz Industrial, Scientific, Medical (ISM) band and provides an output of +4dBm max, and a receiver sensitivity of -70dBm. The module operates from a 2.2 to 3.6Vdc supply and offers a power consumption of just 30ľA in Deep Sleep Mode.
FME has also developed an applications board, which incorporates a Fujitsu microcontroller and integrated memory in addition to the Bluetooth module. Prototype boards are currently being tested and will soon be available with software examples and source code. This allows customers to build and test very fast stand-alone systems such as hand held products or other mobile devices with low current consumption for wireless communications.
Simply add an external antenna and the MBH7BTZ03 can create Bluetooth® wireless technology enabled products. The module has been in mass production since December 2003.
Bluetooth is a trademark owned by Bluetooth SIG, Inc., USA and licensed to Fujitsu Limited.
About Fujitsu Microelectronics Europe
Fujitsu Microelectronics Europe (FME) is a major supplier of semiconductor and display products. The company provides advanced systems solutions to the automotive, digital TV, mobile telephony, networking and industrial markets. Engineers from design centres dedicated to microcontrollers, mixed-signal, wireless, FRAM, multi-media ICs and ASIC products work closely with FME's marketing and sales teams throughout Europe to help satisfy customers' system development requirements.
This solutions approach is supported by a broad range of advanced semiconductor devices, IP and building blocks as well as leading-edge LCDs and Plasma Display Panels.
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