TTPCom and Intel Partner for EDGE and 3G Platforms for Mobile Devices

2/26/2004 - TTP Communications plc announces that its subsidiary TTPCom Ltd has extended its collaboration with Intel Corporation to encompass the development of EDGE and 3G platforms for mobile devices. This builds on the extensive work that the companies have undertaken over the last few years in GSM/GPRS. The combination of Intel’s cellular processors and TTPCom’s protocol and application software provides the performance and flexibility required for the rapid development of next generation handsets, smartphones and converged mobile devices. The first customer to be announced for the 3G platform is ASUSTeK Computer Inc., a leading manufacturer of handheld devices and computing equipment, who are developing a range of 3G feature phones and smartphones for launch towards the end of 2004.

In 3G, TTPCom and Intel are developing a complete dual-mode 3G/GSM platform which enables mobile devices to handover seamlessly between existing GSM/GPRS networks and new 3G networks. The first 3G chip to be made available is a new family of cellular processors, codenamed “Hermon” disclosed by Intel today at the 3GSM World Congress.

To enable handset and mobile device manufacturers to take advantage of higher network speeds prior to the deployment of 3G, Intel launched a complete EDGE solution based on the Intel PXA800EF cellular processor last fall. With three times the bandwidth of existing 2.5G (GPRS) networks EDGE enables the early deployment of 3G type services and EDGE capable handsets will be able to offer advanced services such as video messaging, high quality multimedia and increased data capabilities. TTPCom is supporting this solution with a complete protocol and application software platform.

“The combination of Intel’s hardware solutions with TTPCom’s proven software provides mobile device manufacturers with state of the art platforms, and the extension of our work from GSM/GPRS to EDGE and 3G delivers a very clear roadmap for the development of next generation terminals,” stated Tony Milbourn, Managing Director at TTPCom. “The advanced capabilities of Intel’s cellular processors provide a powerful hardware environment for exciting new products such as smartphones and multimedia rich mobile devices, whilst in the applications space, TTPCom’s flexible framework enables the rapid integration of new services that exploit the increasing bandwidth available from EDGE and 3G networks".

“Our commitment to TTPCom’s advanced software builds on our successful entry into the wireless communications market and provides a clear roadmap for future product developments,” stated Gadi Singer, Intel vice president and general manager of its Cellular and Handheld Group. “Each stage of our product offering builds on a common architecture, utilises common development tools and benefits from years of TTPCom’s conformance and interoperability testing. Manufacturers developing multiple products based on the combined Intel/TTPCom solutions will gain many synergies including lower investment costs, reduced risk from re-use of proven technology and ultimately a much faster time to market".

Demonstrations at 3GSM World Congress
On TTPCom’s stand number A3 in Hall 1, Intel and TTPCom will be demonstrating their 3G platform featuring the new “Hermon” chip announced today by Intel. The “Hermon” family provides the base hardware for the development of dual mode 3G/GSM devices and is fully integrated with TTPCom’s protocol and application software.

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