TI's VoIP Products Power LG Electronics' Next-Generation Media Gateways

12/20/2004 - Texas Instruments Incorporated (TI) (NYSE:TXN) announced that LG Electronics Ltd. (LGE) has chosen TIs Voice over IP (VoIP) products for its access gateway platforms and next-generation trunking gateways. These complete, integrated VoIP solutions, featuring industry-leading solution density and low power, incorporate TIs programmable digital signal processor (DSP)-based series of access communications processors and field-proven Telogy SoftwareTM for VoIP.

TI silicon and software currently power LGE's Compact Access Module (CAM), Total Access Module (TAM) and trunking gateways. The combination of processing power, memory, and ultra-low power, make TI's carrier-class VoIP solution, the TNETV3010, the most advanced VoIP processor available. As the marketplace continues to mature, the two companies expect their agreement on next-generation products to enhance the feature set and functionality of these platforms. This will also include further work together on LGE's trunking gateways, which are intended to replace existing toll telecom exchange.

"TI's VoIP solutions are enabling LGE to create very efficiently designed carrier-class gateways," said Hyeon-Cheol Yi, general manager, NGN department, core network R&D lab, LG Electronics. "The integration of TI's DSP technology and Telogy Software provides us with a critical component for our next-generation gateway platforms, which will be rolled out in 2005. This should afford our customers the most advanced and highest quality Voice over Packet systems in the industry."

TI's VoIP product suite combines hardware and software-based functionality on an optimized architecture. TI's TNETV3010 VoIP solution features the industry's lowest power consumption and "solution density" - the capability to deliver the highest number of channels on a chip, while reducing power consumption, board-size and cost, and simultaneously increasing network performance. According to In-Stat/MDR, TI's VoIP solutions represent over 80 percent of the total VoIP integrated circuit shipment volume for VoIP gateways and infrastructure equipment.

"LG Electronics' choice to use TI's VoIP solution was an outcome of the strategic relationship that exists between our two companies as we collaborate to deliver LGE's next-generation of advanced media gateways to the global infrastructure market," said Irvind Ghai, director, VOP Asia-Pacific, TI's VoIP Business Unit. "We're very excited to be working closely with LGE to enhance the features and functionality of their packet-based gateway families."

Texas Instruments Broadband Solutions
For OEMs developing broadband communications solutions, TIs advanced signal processing-based silicon and software platforms deliver the optimal performance, lower power consumption, and system-level integration required to rapidly deploy differentiated next-generation products for cable modems, digital subscriber line (xDSL) modems, integrated access devices (IADs), VoIP gateways, carrier infrastructure, and home and office wireless networking. See www.ti.com/broadband.

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