Ironwood Enables Users to Socket .5mm Pitch, 400 Ball BGA/CSP Devices

12/10/2004 - Ironwood Electronics’ new high performance Socket – SG-BGA-7026 allow 0.5 mm pitch, 11X11mm body IC’s to be used in socket and operate without compromising performance in very high speed computing and communication applications. The new 10+ GHz bandwidth sockets easily support very dense BGA stacked devices utilizing a high performance conductive elastomer contactor. The contact resistance is normally 10 milliohms.

The sockets have a precision design, which guides the IC to the exact position for connection of each ball and uses an aluminum heat sink screw to provide compressive force. The socket accommodates IC packages such as the AMKOR MAF223 BGA, 0.5 mm pitch, and arrays with up to 400 balls. The socket requires no solder and no mounting holes and requires only 1.25 mm perimeter space for the socket body on the target PCB.

These patented ZIF sockets are simply mounted to the target PCB by an epoxy band around the perimeter. The socket is placed into position with a precision alignment tool and epoxied in place. There are special grooves on the socket wall for additional epoxy strength. The contactor can be easily replaced after hundreds of cycles.

Call for pricing information
Tel: 651-452-8100 or (800) 404 – 0204
Fax: (651) 452 – 8400

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