12/9/2004 - Ramtron International Corporation (Nasdaq:RMTR), the leading supplier of non-volatile FRAM memory products, has announced the availability of select FRAM (ferroelectric random access memory) products in DFN (dual flat no-lead) plastic packaging. The existing FRAM products that are now offered in this thin package with a small PCB (printed circuit board) footprint are the FM24CL16, FM25CL64 and FM25L256 devices.
The FM24CL16 is offered in a 3.0mm x 6.4mm package, and the FM25CL64 and FM25L256 are available in a 4.0mm x 4.5mm package. Both packages are only 0.75mm high. The 3.0mm x 6.4mm version is compatible with industry-standard TSSOP8 packages, making it suitable for a drop-in replacement. DFN packaging is planned for additional Ramtron FRAM products.
All new DFN packages are provided in "green" lead-free packaging that is compliant with EC RoHS (Restriction of Hazard Substances in Electrical and Electronic Equipment). DFN advanced packaging enables designers to use fast-write, high-endurance FRAM in low-headroom applications, while reducing cost and increasing available board space for other functions. These tiny memories are targeted for consumer video games, disposable medical tags and HDTV sets.
Ramtron International Corporation (NASDAQ: RMTR) is the leading supplier of non-volatile ferroelectric semiconductors including serial and parallel ferroelectric random access memory (FRAM) devices and Processor Companion devices that integrate a variety of commonly needed discrete analog and mixed-signal functions for processor-based systems. Ramtron's patented FRAM technology allows devices to perform the functions of both RAM and non-volatile memory in a single chip. Its unique benefits are revolutionising memory-based designs in a variety of automotive, communications, computing, consumer, industrial control, medical and metering applications. Additionally, Ramtron works with various leading edge licensee and manufacturers to bring its technology to market. For more information visit www.ramtron.com
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