IBM Microelectronics Invites Tundra to be Founding Member of

12/6/2004 - Tundra Semiconductor Corporation (TSX:TUN), the leader in System Interconnect, announced that it has been invited by IBM Microelectronics to participate as one of the founding members in This organization is an open standards community built around chips and systems that use Power Architecture(TM) technology. was launched this week in Beijing, China.'s mission is to develop, enable and promote Power Architecture technology as the preferred open standard hardware development platform for the electronics industry. The organization will administer qualification programs to ensure interoperability and accelerate customer innovation and time-to-market for future applications.

The Community is made up of leaders from the consumer electronics, networking, automotive and IT industries. Founding members include AMCC, Bull, Cadence Design Systems, Chartered Semiconductor Manufacturing, Culturecom, IBM, Jabil Circuit, Novell, Red Hat, Shanghai Belling, Sony, Synopsys, Thales, and Wistron.

"Participating as a founding member of gives Tundra a unique position from which to influence the direction of PowerPC-based System Interconnect today, and for years to come," said Jim Roche, President and CEO at Tundra. "It strengthens our already vibrant partnership with the key players in the PowerPC market, including IBM. We expect to reinforce our market lead in PowerPC System Interconnect while we enable the growth of the overall PowerPC market."

"Power Architecture is the underlying technology used in PowerPC," said Rick O'Connor, Chief Technology Officer and VP Product Management at Tundra. "PowerPC System Interconnect is a key product line at Tundra. This product line includes the PowerSpan(TM) II Multi-port PCI Bus Switch, the Tsi106(TM) and Tsi107(TM) PowerPC Host Bridges and the recently announced Tsi108(TM) PowerPC Host Bridge. Through Tundra confirms its leadership role in PowerPC System Interconnect and strengthens the offerings we deliver to our customers."

"Tundra is an important enabler for Power processors and owns a key role in the infrastructure today," said Mark Ireland, Power Microprocessor Business Line Executive at IBM. "Their participation in is a critical element to the community's growth and success. IBM has a long history of working with Tundra, and we look forward to collaborating with them in as they enable new applications for the Power processor market."

Tundra Semiconductor Corporation designs, develops, and markets standards-based System Interconnect for use by the world's leading communications and storage system companies. Tundra supports RapidIO, VME, PCI/X standards. Tundra System Interconnect is a vital communications technology that enables customers to connect critical system components while compressing development cycles and maximizing performance. Applications include wireless infrastructure, storage networking, network access, military applications, and industrial automation. Tundra headquarters are located in Ottawa, Ontario, Canada. The Company also has a design center in South Portland, Maine, and sales offices in the U.K., across the US and in Asia. Tundra sells its products worldwide through a network of direct sales personnel, independent distributors and manufacturers' representatives. Tundra employs about 200 employees worldwide.

TUNDRA is a registered trademark of Tundra Semiconductor Corporation (Canada, U.S. and U.K.). TUNDRA, the Tundra logo, and Design. Connect. Go. are trademarks of Tundra Semiconductor Corporation.

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