TI and COMMIT Drive 3G Wireless Innovation in Asia

11/18/2004 - COMMIT Incorporated, a research and development joint venture with Chinese communications equipment manufacturers, and Texas Instruments Incorporated (TI) (NYSE: TXN), are driving 3G wireless innovation in Asia, providing the Chinese wireless industry with a flexible TD-SCDMA chipset solution easily customized for supporting complex 3G applications. The TI and COMMIT solution incorporates TI´s OMAPTM multimedia processors and digital signal processing (DSP) technology. TI and COMMIT will be demonstrating a 3G TD-SCDMA prototype handset developed by one of its customers, which includes TI´s OMAP processor and tested with various infrastructure partners, during the 3G World Congress in Hong Kong, November 16 - 18, 2004.

Working together to drive 3G growth in China, the TI and COMMIT chipset provides an open, trusted alternative chipset solution to the Chinese wireless industry, which until recently has been dependent on imported technology. Locally designed to support TD-SCDMA, the "home grown" 3G standard for China, the COMMIT and TI chipset solution enables handset manufacturers to dramatically shorten their time to market, thus speeding up the industrialization process of the 3G TD-SCDMA industry. TD-SCDMA is becoming an important technology for Asian operators for both their current and evolving networks in order to support efficient high-speed packet data services.

COMMIT recently announced its complete chipset solution and architecture for TD-SCDMA terminals integrating TI technology, including the RF, analog baseband and digital baseband chip, TI's OMAP processor, and its protocol stack software, which support the TD-SCDMA voice and data requirement. The complete chipset solution will be ready for mass production in 2005. Handset manufacturers such as LG, Bird and DBTel are already developing TD-SCDMA terminals based on the TI and COMMIT chipset solution. As of today, COMMIT is the only company currently offering a complete chipset solution for TD-SCDMA terminals, allowing COMMIT to better manage evolving product requirements and to control the cost and the performance of the total solution.

TI is one of several major industry players working with COMMIT to drive 3G TD-SCDMA growth in China, including China Putian, China Academy of Telecommunications Technology, LG Electronics and DBTel. TI's leadership in 3G is reflected in the numbers: 6 of the top 7 worldwide 3G handset manufacturers use TI's modems, OMAP processors, or both, including analog. TI also provides infrastructure technology to 9 of the top 10 base station OEMs, capturing 90% market share in 3G. In addition, TI has optimized DSP and analog solutions for TD-SCDMA deployments, including a newly announced 850 MHz processor core and analog data converters.

"3G is picking up steam around the globe, and China is no exception," said Gerald Kuo, TI China Managing Director. "TI's wireless systems know-how drives significant value for TI customers in the form of hardware and software solutions designed specifically for the wireless environment, including 3G. Through the cooperation between COMMIT and TI, COMMIT is able to provide a complete TD-SCDMA terminal solution compliant with 3GPP standards. This will be a driving force to promote TD-SCDMA in the worldwide 3G market."

"COMMIT's chipset solution will speed up the commercialization of TD-SCDMA phones," said Dr. Xiongqiang Tao, Chairman of the TD-SCDMA industry alliance and COMMIT board of directors. "Because of TI's wireless systems know-how and through our close cooperation with handset manufacturers and infrastructure vendors during the research and development phase, this new TD-SCDMA chipset solution can better satisfy customer requirements and interoperate with various infrastructures, which should accelerate the COMMIT solution launch to market."

TI at 3G World Congress
TI will exhibit its latest wireless technology at booth #1204, Hall 7A and 7B, during 3G World Congress at the Hong Kong Convention and Exhibition Centre, held November 16-19. Further, on November 18, Douglas Rasor, Texas Instruments Vice President and Manager of Strategic Marketing, will provide a keynote address during the "Technology Leader Perspectives" session. From the vantage point of a leading supplier to 3G handset pioneers, Rasor will provide an early look at the key drivers that have emerged for 3G and deliver TI´s perspective on what it will take to make 3G a high-volume, high-revenue market. Rasor will place special emphasis on the company´s view that the 3G market will be driven by revenue-generating applications and services such as the exciting new field of mobile entertainment. Jeff Wender, TI OMAP Business Development Manager, will address emerging multimedia technologies that are transforming mobile phones from trendy gadgets into high-quality, personal entertainment centers. He will speak during the track "Delivering Next-Generation Mobile Devices through Software and Semiconductor Innovation," on November 18.

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