11/4/2004 - IDTTM (Integrated Device Technology, Inc.; Nasdaq: IDTI), a leading communications IC company, announced its leadership in providing “Green” and lead-free products by offering 99 percent of its currently available devices in lead-free and fully Green packaging.
“The IDT Green and lead-free programs are among the furthest along that I have seen,” said ISO 9001 lead auditor, Bruce Eng, Underwriters Laboratories, Inc. “I applaud the company’s leadership in forwarding Green initiatives in the semiconductor industry.”
Richard Groover, vice president of process engineering with Amkor Technology, Inc. (Nasdaq: AMKR), Chandler, Ariz., added, “As a leading provider of contract semiconductor assembly and test services, we appreciate the growing importance of using environmentally friendly materials. In keeping with this responsibility, IDT offers an impressive range of Green IC products.”
As of September 2004, the IDT Green program has accomplished the following:
“It is globally essential for our industry to provide environmentally safe components for electronics systems,” said Anne Katz, vice president of worldwide assembly and test operations at IDT. “We challenge other semiconductor companies to go Green throughout their product lines.”
IDT is among many companies participating in an industry-wide effort that is developing lead-free solders and semiconductor packaging technologies. The objectives are applying lead-free processes that are cost-effective and which maintain equivalent or improved levels of reliability. Soldering and plating technologies are used throughout the electronics industry, so techniques for lead-free assembly can be shared. Leading manufacturers are addressing a range of issues relating to higher temperatures required for reflow and wave lead-free soldering. The efforts include standard ways of evaluating product quality and reliability. Currently, the industry’s focus is making terminals and semiconductor solder-ball connections lead-free. Additionally, work is underway to eliminate lead inside chip packages.
IDT is a global leader in preemptive semiconductor solutions that accelerate packet processing for advanced network services. IDT serves communications equipment vendors by applying its advanced hardware and software technologies to create flexible, highly integrated solutions that enhance the functionality and processing of network equipment. IDT accelerates intelligent packet processing with products such as switching solutions, network search engines (NSEs), programmable content inspection engines (CIEs), flow-control management (FCM) ICs and its family of InterpriseTM integrated communications processors. The portfolio also comprises products optimized for communications applications, including telecom products, FIFOs, multi-ports, and timing solutions. In addition, the product mix includes high-performance digital logic and high-speed SRAMs to meet the requirements of leading communications companies.
Headquartered in Santa Clara, Calif., the company employs approximately 3,200 people worldwide and has a wafer manufacturing facility in Oregon, and test and assembly facilities in the Philippines and Malaysia. IDT stock is traded on the Nasdaq Stock Market® under the symbol “IDTI.” The company is included in the S&P 1000, which is a combination of the S&P MidCap 400 and S&P SmallCap 600 Indices, and is also part of the S&P SuperComposite 1500, which combines the S&P 500, MidCap 400, and SmallCap 600. Additional information about IDT is accessible at www.IDT.com.
IDT, Interprise and the IDT logo are trademarks of Integrated Device Technology, Inc.
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