Cypress Expert Shares Best Practices for Lead-Free Manufacturing

10/22/2004 - Cypress Semiconductor Corp (NYSE: CY) announced that its manufacturing director John Quist will participate in a panel discussion on environmental compliance at this week’s Global Supply Chain Management Conference.

The panel, entitled “Product Content Management Issues, Tools and Experiences,” will discuss how Restriction of Hazardous Substances (RoHS) compliance requirements are affecting current product life cycles and customer deadlines for “lead-free” manufacturing. The event will be held on Wednesday, October 20 at 8:00 a.m. on the campus of Applied Materials, Inc., 3050 Bowers Avenue in Santa Clara, Calif.

“Everyone in the supply chain is focused on the RoHS deadline in 2006, but most component suppliers must convert to ‘green’ products before then,” said Quist. “The earlier deadlines impact product lifecycles and decisions at every level of the company from product launch, through design, to manufacturing and qualification.”

In addition to addressing how to best manage product lifecycles, Quist will also discuss the importance of establishing a "common language" across the supply chain. “There are no industry-standard definitions for ‘green’, and the ‘lead-free’ standard has changed over time. It is imperative that everyone in the supply chain speak the same language,” he said.

Earlier this year, Cypress announced that it will offer lead-free packages using nickel-palladium-gold leadframe packaging for all new integrated circuit (IC) products by the end of the third quarter 2004, and that it plans to meet the balance of customer “green” requirements in 2005.

About the Speaker
John Quist has 20 years of semiconductor manufacturing experience and is a recognized lead-free and manufacturing expert. Over the past two years, he has been working closely with Cypress’s customers and factory to prepare for the conversion to lead-free manufacturing.

About Cypress
Cypress Semiconductor Corporation (NYSE: CY) is Connecting From Last Mile to First MileTM with high-performance solutions for personal, network access, enterprise, metro switch and core communications-system applications. Cypress ConnectsTM using wireless, wireline, digital and optical transmission standards, including USB, Fibre Channel, SONET/SDH, Gigabit Ethernet and DWDM. Leveraging its process and system-level expertise, Cypress makes industry-leading physical layer devices, framers and network search engines, along with a broad portfolio of high-bandwidth memories, timing technology solutions and reconfigurable mixed-signal arrays. More information about Cypress is accessible online at

Cypress and the Cypress logo are registered trademarks of Cypress Semiconductor Corporation. "Connecting From Last Mile to First Mile" and "Cypress Connects" are trademarks of Cypress.

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