10/4/2004 - Ironwood Electronics’ new high performance Socket combo (assembled back to back) – SG-BGA-6130 allows 1 mm pitch 3528 position (total pin count) BGA IC’s to be used in socket and operate without compromising performance in very high speed communication or computing applications where the devices are assembled back to back on to the target PCB. The new GHz bandwidth socket combo easily supports high pin count BGA devices utilizing a high performance conductive elastomer connector.
The contact resistance is normally 10 milliohms. The sockets have a precision design, which guides the IC to the exact position for connection of each ball and uses aluminum heat sink screws to provide compressive force to ensure full electrical contact. The socket shown in the picture is SG-BGA-6130 for 42.5 mm IC body size. The socket combo accommodates IC packages such as the Xilinx FF1704 BGA, 1 mm pitch, 42x42 arrays. When large BGA’s are mounted back to back, the amount of PCB circuitry for chip-chip interconnect is greatly reduced and PCB wiring loading is also reduced.
These patented ZIF socket combos are simply mechanically mounted to the target PCB (both component and solder sides). The socket lid is twisted open, the IC is inserted, the lid is closed and aluminum heat sink screw is rotated to provide downward force on the IC. The individual socket is 8.48 mm high and only 2.5 mm per side larger than the actual IC packages, minimizing footprint on system boards while maximizing system speeds. These sockets are also designed to accommodate filter capacitors closest to the BGA pads. The socket body and heat sink screw are constructed with aluminum to facilitate heat-sinking.
The SG-BGA-6130 is available immediately. Call for pricing information.
990 Lone Oak Rd., Suite 120
Eagan, MN 55121
Tel: 651-452-8100 or (800) 404 – 0204
Fax: (651) 452 – 8400
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