TI's AR7 ADSL Router-on-a-Chip Powers Westell's WireSpeed Modems

8/26/2003 - Westell Technologies, Inc. (NASDAQ: WSTL), a leading provider of broadband access solutions, and Texas Instruments Incorporated (TI) (NYSE: TXN) announced that Westell has selected TI's DSL router-on-a-chip to support the recently announced expansion of its family of WireSpeedTM modems.

The new WireSpeed ProLineTM and LiteLineTM products integrate TI's AR7 single-chip ADSL modem technology. These two new distinct Westell WireSpeed product lines are based on the new ITU standards for ADSL2, ADSL2+ and Reach Extended ADSL2 (READSL), which deliver higher ADSL speeds to customers and allow service providers to extend their service areas.

"Our two new exciting WireSpeed product lines, which integrate TI's AR7 technology, will accelerate the opportunity for DSL installations and further strengthen Westell's DSL portfolio of modems," said Gordon R. Reichard, Jr., Vice President of Marketing, Westell Technologies. "Westell and TI are working to drive the industry to bring affordable, quality broadband solutions to consumer and small business customers," Reichard added.

"Our partnership with Westell and their innovative product development have played an instrumental role in enabling higher ADSL speeds and increased coverage area for service providers," Greg Jones, general manager of TI's DSL Business Unit, said. "Westell is the first to announce their support and use of AR7, TI's industry leading single chip ADSL router. The spirit and dedication of our continuing working partnership with Westell has produced two new product lines leveraging both companies' strengths in DSL," Jones said.

Both new product lines will be produced in Westell's U.S. factory located in Aurora, Illinois. The products are currently undergoing testing in service provider labs and will be available for volume shipment in October. ADSL2, ADSL2+ and READSL will be available via simple software upgrade in January 2004.

WireSpeed is a trademark of Westell Technologies, Inc.

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