Agilent Versatest Reduces Cost of Flash Memory Chips Test for Winbond

7/17/2003 - Agilent Technologies Inc. (NYSE: A) announced that Winbond, a leading provider of mobile electronic products, has selected the Agilent Versatest Series Model V4400 to reduce cost of test.

The V4400's versatile feature set provides Winbond with maximum flexibility to test both emerging flash memory and DRAM semiconductor chips, the basis of many mobile consumer devices, including cellular telephones, MP3 players and personal digital assistants. Winbond's selection of the Agilent V4400 continues Agilent's market leadership in the growing Taiwanese flash memory manufacturing industry.

"Using a single system for both memory types allows us to rapidly adjust to changing production volumes, reducing our financial risk by enabling us to capitalize on shifting market demand for our memory products," said George Chou, Director, Winbond. "Winbond continues to focus on refining its manufacturing capabilities and flexible production strategies in order to more quickly respond to market changes. We believe that the prominent features of the Agilent V4400 combined with our market-leading test techniques will ultimately provide the best solution for our customers."

"Winbond's selection of the V4400 is another proof point that versatility and high-throughput test performance create an undeniable cost-of-test benefit across our customers' memory portfolios," said Pi Chao, business development manager for Agilent's Memory Test Division. "We're very proud of the customer relationship we have with Winbond, and look forward to working together with them to increase their competitive advantage and presence in Taiwan's memory manufacturing sector."

The Agilent V4400 also features a custom computer integrated manufacturing (CIM) software program, allowing Winbond to easily integrate the V4400 with their existing factory host. The CIM program provides Winbond with extensive data analysis capability including real-time yield information that enables quick analysis of test data for real-time process adjustment. The CIM software ultimately allows Winbond to focus on increasing yields and productivity instead of being distracted by equipment and data integration issues.

More information on Versatest Series Test Solutions is available at

About Winbond
Winbond Electronics Corporation was founded in 1987 and is based in Hsinchu Science-Based Park, Taiwan. It has since become the largest branded IC Company in Taiwan, offering a broad range of micro controller-based consumer IC, PC and peripheral ICs, network access IC and memory ICs. Winbond is a market leader in PC I/O controllers and speech synthesizers in Taiwan and East Asia. Currently, Winbond has three wafer fabs in operation and utilizes process technology down to 0.11 micron. With more than 3,800 employees worldwide, the Company has subsidiaries in San Jose, USA; Japan; Hong Kong and Shanghai, China. Further information is available at:

About Agilent Technologies
Agilent Technologies Inc. (NYSE: A) is a global technology leader in communications, electronics, life sciences and chemical analysis. The company's 32,000 employees serve customers in more than 110 countries. Agilent had net revenue of $6 billion in fiscal year 2002. Information about Agilent is available on the Web at

Previous Page | News by Category | News Search

If you found this page useful, bookmark and share it on: