7/15/2003 - Vincent Tong, Vice President of Product Technology at Xilinx, will be at the Semicon West 2003 Advanced Packaging Seminar for an in-depth look at the next-generation FPGA technology driving leading-edge IC process and advanced packaging technologies. In his keynote presentation, Mr. Tong will discuss the new technology partnership model with foundry, assembly sub-con, and equipment vendors that has emerged to support the doubling of complexity in technology every 18 months according to Moore's Law. This successful partnership model has enabled revolutionary new programmable system FPGA platforms to deliver solutions to new and emerging applications in market segments around the world.
Advanced Packaging Seminar at Semicon West 2003
July 17, 2003, 9:00 a.m. - 12:00 p.m.
Fairmont Hotel, San Jose, CA
The Advanced Packaging Seminar is an ideal opportunity for attendees to learn about the latest developments and trends associated with the flip chip, wafer level packaging and interconnect arenas. Presentations will discuss process, material and equipment innovations, and provide insight into the future of the advanced packaging and interconnect market segments. Presenters include ChipPAC, E&G, Engent, Inc., SUNY, and Xilinx.
For additional information and to register now, visit: http://www.apialliance.com/semicon_west/agenda.shtml
Xilinx, Inc. (NASDAQ: XLNX) is the worldwide leader of programmable logic solutions. Additional information about Xilinx is available at www.xilinx.com.
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