6/26/2003 - Ziptronix, a pioneer in three dimensional integrated circuits, announced that Ivo Bolsens, Vice President and Chief Technology Officer of Xilinx, Inc. (NASDAQ: XLNX), the world leader in programmable logic solutions, has been appointed to the Ziptronix Technical Advisory Board.
"Ivo will provide invaluable perspectives and insights to Ziptronix as we further define our technology roadmap," said Doug Milner, President and CEO of Ziptronix. "He also has a sterling track record for research in the wireless communications area, which is one of the key markets where Ziptronix's bonding and 3D integration technology can provide substantial benefits."
Xilinx leads one of the fastest growing segments of the semiconductor industry - programmable logic devices (PLDs) with 49% market share. PLDs represent an exciting growth potential in the chip market thanks to their flexible nature and ability to change functionality even after being manufactured. Bolsens is responsible for identifying Xilinx technologies and talent as well as heading up the Xilinx Research Laboratories, which focuses on advanced research in the area of programmable logic. He joined Xilinx in June 2001 as Vice President and CTO.
Bolsens came to Xilinx from the Belgium-based research center IMEC, where he was vice president of information and communication systems. Joining the organization in 1984, his research included the development of knowledge-based verification for VLSI circuits, design of digital signal processing applications, and wireless communication terminals. He also headed the research on design technology for high-level synthesis of DSP hardware, hardware/software co-design and system-on-chip design.
"Ziptronix's bonding and 3D integration technologies address key issues that the semiconductor industry is facing right now," Bolsens said. "While mask costs and NREs continue to skyrocket in system-on-a-chip design, Ziptronix's technology provides a distinctive, viable methodology for the industry to achieve larger scale integration while slashing development costs and time-to-market cycles. I look forward to the challenge of helping Ziptronix's technology become widely adopted by the industry in meaningful way."
Ziptronix, recently completed $17.4 million in a second round of venture financing. This new investment will accelerate development of custom 3D IC products aimed at wireless communications, Wi-Fi and other networking applications.
Ziptronix last year commercially introduced its ZiROC®, adhesive-free semiconductor bonding technology as well as its patented ZiCONTM, 3D interconnect technology. The combination of these technologies has been widely recognized to provide new possibilities for ultra-dense 3D semiconductor applications, new low-cost wafer-scale MEMS encapsulation solutions, and custom-engineered semiconductor substrates.
Ziptronix raised its first $6.5 million in January of 2001 from Alliance Technology Ventures and Xilinx Inc.
Founded in October 2000, Ziptronix is a privately held company spun from the Research Triangle Institute to commercialize ten years of research and development leading to the fabrication of three-dimensional integrated circuits. Its proven technology is being applied to development projects for major semiconductor manufacturers. Ziptronix provides a complete in-house prototyping fab for wafer bonding, wafer-scale encapsulation and the production of 3D integrated circuits. Ziptronix is the first company to provide the semiconductor industry with a revolutionary adaptation of standard industry processes, which enables MEMS assembly, packaging, and testing to be cost-effectively integrated into volume production at the foundry. Ziptronix corporate headquarters are in Research Triangle Park, North Carolina. More information about Ziptronix is available through the World Wide Web at http://www.ziptronix.com.
Xilinx, Inc. (NASDAQ: XLNX) is the worldwide leader of programmable logic solutions. Additional information about Xilinx is available at www.xilinx.com.
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