6/18/2003 - Atmel® Corporation (Nasdaq: ATML) announced that its Silicon-Germanium (SiGe) front-end IC T7024 will be integrated into new Bluetooth® Class 1 products from Zeevo, a major manufacturer of Bluetooth-certified one-chip solutions. Typical applications requiring a higher link range up to 100 meters and beyond include USB adapters, serial adapters, portable printers, remote sensing, home automation and industrial control systems.
The T7024 is part of Atmel's front-end family T702x and includes PA, LNA and antenna-switch driver in one package. In addition to improved RF performance, SiGe technology enables more cost-effective solutions than conventional GaAs technology and reduces BOM costs for complete Class 1 designs. The PA achieves an output power of +23 dBm at 3 V and offers a high PAE of up to 45%. The LNA has an excellent noise figure of 2.1 dB. By increasing both output power and receiver sensitivity, this solution boosts the transmission distance of Zeevo's TC2001 beyond 100 meters as provided by conventional BT Class 1 solutions.
"The architecture of Atmel's highly integrated SiGe deviceT7024 enables us to manufacture leading-edge Bluetooth solutions with outstanding RF performance while simulatenously reducing complexity and simplifying the production process of Class 1 designs for our OEM customers." said Bob Van Steenburgh, VP of Marketing at Zeevo.
The T7024, available in PSSO20 and QFN20 packages, is manufactured in high volume. Pricing starts at US$ 0.90 (10 k).
BOM = Bill of Material
Class 1 = Bluetooth standard (100 meters)
LNA = Low Noise Amplifier
PA = Power Amplifier
PAE = Power Added Efficiency
SOC = System On Chip
Founded in 1984, Atmel Corporation is headquartered in San Jose, California with manufacturing facilities in North America and Europe. Atmel designs, manufactures and markets worldwide, advanced logic, mixed-signal, nonvolatile memory and RF semiconductors. Atmel is also a leading provider of system-level integration semiconductor solutions using CMOS, BiCMOS, SiGe, and high-voltage BCDMOS process technologies.
Zeevo, Inc. is a privately owned fabless semiconductor company based in Santa Clara, California. The company was founded in 1999 to develop and market "systems-on-a-chip" solutions for the communications marketplace. Zeevo offers the most integrated Bluetooth SOCs with all the RF components such as filter, balun, and matching network integrated on to the single chip solution. Zeevo's programmable software-based architecture and ease of RF design enables designers to develop products with ease and provides highly accelerated time-to-market. For more information, visit Zeevo's web site at http://www.zeevo.com./.
Atmel® and combinations thereof are the registered trademarks of Atmel Corporation or its subsidiaries. The Bluetooth word mark and logos are owned by the Bluetooth SIG, Inc. and any use of such marks by Atmel® is under license.
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