5/13/2003 - ParthusCeva, Inc. (Nasdaq: PCVA, LSE: PCV) the leading provider of licensable Digital Signal Processor (DSP) cores and platform-level IP to the semiconductor industry, together with EoNex Technologies, Inc., a Korean semiconductor company, announced that EoNex is basing its 2G, 2.5G and 3G wireless modem chips on ParthusCeva's TeakLite® DSP Core. EoNex's TeakLite-powered modems chips are used with current and future generation cellular standards including CDMA, W-CDMA, and CDMA2000.
EoNex targets the fast emerging Korean and Chinese wireless handset developers and manufacturers with its modems based on ParthusCeva's programmable TeakLite DSP core. TeakLite enables the development of low power handset modems and is an optimum solution for the modem functionality, low-power speech and audio processing required by mobile and communication devices.
EoNex has successfully developed and introduced CDMA, CDMA2000 1x single mode, W-CDMA single mode and CDMA2000 1x / W-CDMA dual mode modem chips. EoNex is planning to expand its product line further by the end of 2004 with triple-mode modem chips including W-CDMA/CDMA2000 1x/1x EV-DO and dual-mode modem chips for W-CDMA / TD-SCDMA. ParthusCeva DSP cores will be powering these EoNex wireless modems chipsets. EoNex is also developing an optimized protocol stack software that is tightly integrated with EoNex's modem chip in the SoC environment.
"Basing our product line on ParthusCeva's compact, low-power, high-performance programmable TeakLite DSP core enables us to extend handset battery life for modems running in single, dual and even triple modes," Mr. S.B. Kim, EoNex Director of ASIC and System Department, explained. "Our one-stop solution package of modem chip and protocol stack software provides terminal set manufacturers with a considerable reduction in terminal set design cycle and development cost."
"Korea and China are the fastest growing markets for 2.5 and 3G wireless terminals," said Bat-Sheva Ovadia, ParthusCeva's Strategic Marketing and Business Development VP. "EoNex's selection and deployment of our TeakLite DSP core further extends our position as the licensed DSP of choice in wireless."
TeakLite is a 16-bit fixed-point general-purpose DSP core. Designed for low power and high-performance applications such as cellular handsets, MP3 players, disk drive controllers, cordless, VoIP terminals and various embedded control applications. TeakLite, a fully synthesizable soft core, is a process independent core that is easily portable to any ASIC library.
The TeakLite is a member of ParthusCeva's SmartCoresTM family. These low-power, fixed-point licensable DSP cores offer a range of performance, price and power consumption balances, addressing a wide range of applications, from low-end, high-volume applications, such as digital answering machines, hard disk controllers, low speed modems and Voice over IP terminals, to high performance applications such as third generation (3G) cellular communications, broadband modems, consumer multimedia and Voice over IP gateways. A comprehensive portfolio of software and hardware development tools support the SmartCores family. In addition, a large network of third party companies offers applications, tools and design services solutions.
SmartCores licensees benefit from the advanced architecture features, such as:
Cores offered at various performance levels - beginning with single-MAC (OakDSPCore® and TeakLite®) architecture to Dual-MAC (Teak®), Dual-MAC with Instruction Level Parallelism (PalmDSPCore®) and the scalable, multiple MAC and extendible architecture of CedarDSPCore.
EoNex Technologies Incorporated provides a one-stop solution package of tightly integrated and reliable modem chip and protocol software to wireless terminal equipment manufacturers for a time-to-market delivery of cost and performance-effective wireless terminal products. EoNex, founded in Korea in 2000, designs wireless modem chips and protocol stack software focusing on the 2.5G and 3G wireless technologies. EoNex employees possess unique experience in development and commercialisation of the 2G and 2.5G modem chips and protocol stack software in the Korean CDMA market.
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