4/2/2003 - Actel Corp. (Nasdaq: ACTL), a supplier of innovative programmable logic solutions, announced the moisture-sensitivity level 2 (MSL2) certification of its eX family of field-programmable gate arrays (FPGAs) in chip-scale packaging (CSP). A JEDEC standard, MSL2 guarantees a one-year shelf life for packages stored at a fixed temperature in an uncontrolled environment, offering customers greater flexibility for storage and manufacturing, all without compromising system reliability.
This new development will have significant economic benefits for the end-user equipment manufacturer. For packages with higher MSLs, the shelf life deteriorates significantly. Consequently, the manufacturer may add a dry-bake or re-bake step, often required prior to mounting the package on a board or module, in their process. The baking process requires dry bags, trays for baking, moisture indicators, desiccant material, controlled-environment storage and various other logistic challenges, including product staging. These processes increase costs as well as cycle time.
Chip-scale packaging technology for the eX family was provided by ST Assembly Test Services (STATS), a leading semiconductor test and advanced packaging service provider. Jeff Osmun, STATS' vice president, worldwide sales & marketing and president of U.S. operations, commented, "As Actel's manufacturing partner, we share their commitment to provide customers a chip-scale package with increased levels of reliability. By providing MSL2 certification for its eX FPGAs, Actel has minimized a significant manufacturing concern."
"Due to the low cost, low power and small form factor of Actel's eX family in chip-scale packaging, including 'green' packaging options, we have seen tremendous success in a variety of markets worldwide," said Barry Marsh, vice president of product marketing for Actel. "With today's announcement, our customers, particularly those with build-on-demand fulfillment models and those who require greater flexibility for their manufacturing schedules, will reap shelf-life and reliability benefits from Actel's improvement to MSL2."
First introduced in September 2000, the eX family consists of three devices: the eX64, eX128 and eX256 with system gate densities of 3,000, 6,000 and 12,000, respectively. Actel offers a range of chip-scale packages, including 49-, 128- and 180-ball packages.
Pricing and Availability
The MSL2-certified eX FPGAs in CSP are available now at the same competitive prices as Actel's standard products. For further information about volume pricing and availability, please contact Actel.
Corporation is a supplier of innovative programmable logic solutions, including field-programmable gate arrays (FPGAs) based on antifuse Actel Corporation is a supplier of innovative programmable logic solutions, including field-programmable gate arrays (FPGAs) based on antifuse and flash technologies, high-performance intellectual property (IP) cores, software development tools and design services, targeted for the high-speed communications, application-specific integrated circuit (ASIC) replacement and radiation-tolerant markets. Founded in 1985, Actel employs approximately 500 people worldwide. The Company is traded on the Nasdaq National Market under the symbol ACTL and is headquartered at 955 East Arques Avenue, Sunnyvale, Calif., 94086-4533. Telephone: 888-99-ACTEL (992-2835). Internet: http://www.actel.com.
The Actel name and logo are registered trademarks of Actel Corporation.
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