Xilinx Deploys 130nm CMOS on 300mm Wafers with UMC Fab Partner

3/31/2003 - Xilinx, Inc. (Nasdaq:XLNX), the worlds leading provider of programmable solutions, announced production qualification for its industry-leading 130nm Virtex-II Pro on 300mm wafers with fab partner UMC (NYSE:UMC) at its most advanced manufacturing facility, Fab12a in Taiwan.

Xilinx is the first PLD provider to achieve this industry milestone. The company's strategy to deploy 130nm CMOS technology on 300mm wafers will greatly benefit its customer base by providing a proven cost reduction path, without the need for re-qualification. Xilinx leads the industry in 300mm production and attributes its success to its dual fab strategy and close relationships with fab partners IBM and UMC. The 300 mm wafer process offers improved defect densities, and hence better yields, as well as approximately 2.5 times the number of gross die per wafer relative to 200mm processes. The company's aggressive move to 300mm began with its commitment to provide customers with the fastest possible cost reduction path.

“We've always considered 300mm production as a necessary component of our manufacturing strategy and a necessary step in ensuring customer satisfaction,” said Wim Roelandts, president and CEO at Xilinx. “300mm provides the lowest cost of manufacture, lowest defect density, and most advanced high-volume process technology options. Going forward, all Xilinx products will go directly into production on the more cost effective 300 mm wafers.”

“300 mm is a ‘must have’ in today's uncertain economy – cost effective manufacture is paramount and 300mm is the only way for semiconductor suppliers to stay competitive,” said Rich Sevcik, senior vice president and general manager of the Programmable Logic Systems Group at Xilinx. “Suppliers who have chosen to standardize on 200mm need to catch up and make the move to 300 mm in order to reduce costs. The problem is that once they make the necessary move, their customers will suffer by enduring a painful re-qualification process.”

Fu Tai Liou, president of the America Business Group at UMC, stated, "This product qualification milestone proves conclusively that Xilinx is the dominant force in the deployment of advanced process technologies for programmable logic devices. Xilinx's continued success is clearly a by-product of an unwavering commitment to customer satisfaction. UMC is honored to be working hand-in-hand with Xilinx to enable the timely delivery of excellent products that fully leverage the performance and cost benefits of the world's most advanced production technologies."

The Xilinx Virtex-II Pro family is the world's first and only FPGA to offer integrated PowerPC embedded technology and 3.125 Gbps serial transceivers. Virtex-II Pro devices include these multiple PowerPC CPUs and multi-gigabit serial transceivers at no additional charge, providing unequaled capability and value for today's system design requirements.

About Xilinx
Xilinx is the worldwide leader in complete programmable logic solutions. For more information, visit www.xilinx.com.

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