Texas Instruments CEO Demonstrates Wireless Beyond Voice at CTIA Wireless 2003
3/17/2003 - Joining its customers and other industry leaders in recognizing the bright future of the wireless market, Texas Instruments (TI) (NYSE: TXN), the world leader in wireless ICs, will participate in CTIA, one of the largest wireless shows in the telecommunications and computing industries. In addition, TI will demonstrate its antenna-to-applications suite of wireless technology throughout four co-located shows: CTIA Wireless 2003, Microsoft Mobility Conference, Mobile Entertainment Summit and IEEE Wireless Communications and Networking Conference (WCNC).
- Tom Engibous, TI Chairman, President and CEO, Conducts Live Chat Session with CTIA President and CEO Tom Wheeler, 10:30 a.m., Monday, March 17, Hall I Engibous will share his perspective on how systems integration trends are fostering new and innovative technologies as well as explain how TI has created a technological foundation that is now moving the industry beyond voice.
- "TI Solutions: At the Heart of the Wireless World," March 17 - 19, Hall G, Booth #6545 TI will showcase the wireless industry´s broadest range of silicon and software with demonstrations of its cellular terminal and infrastructure chipsets, OMAPTM application processors, 802.11 and Bluetooth solutions, as well as its complete smartphone and PDA reference designs. Come see how TI has delivered the foundation for high-performance, low-power mobile devices enabling richer applications, possibilities and services with demonstrations from leading OMAP Developers -- including Chaoticom, DoOnGo, Esmertec, PacketVideo, RSA, SRS Labs, Superscape, Teleca, Thin Multimedia and Zi Corp. -- all of which will illustrate real-time applications such as multimedia, interactive gaming, secure mobile commerce and location-based services. These demonstrations include 3D race car and space attack games, the wireless delivery of everything from movie trailers and sports highlights to screen savers, quick easy wireless downloads of games, ring tones, PIM apps and other applications, and user interfaces optimized for one-handed operation -- all running on high-performance, low power OMAP processors.
In addition, several solutions from TI´s comprehensive wireless portfolio will be illustrated, some of which include:
- Wireless networking demonstrations of TI´s TNETW1100B low power, 802.11b mini-PCI design for embedded laptop applications, a display of TI´s Access Point Development Kit for hot spot, home and office WLAN deployments and TI-based 802.11 products from D-Link, U.S. Robotics, SMC and Siemens/Efficient Networks
- TI´s 3G Technology Development Kit with a C64xTM class DSP running at 720 mHz, illustrating TI´s high-performance infrastructure solutions
- High speed RTDX using next generation emulation technology to stream application data between the wireless terminal and the base station highlights increased code download speeds that are improved by 8x to 500KBps and data throughput improved by >100x to 2.0 MBps
- Supporting TI´s new CDC7005 Low Phase Noise Clock Synthesizer for wireless basestations, TI will demonstrate the multiplication, division, synchronization and jitter cleaning features using an oscilloscope and clock source to drive the evaluation module and measured with MI Software on a PC
With more than 12 years of wireless expertise, TI provides the vision for the future of the wireless market. Industry experts from TI´s wireless businesses will present their views on a variety of topics throughout the week.
- "Mobile Entertainment: State of the Union," 10:30 a.m., Sunday, March 16, La Louisianne Ballroom Danni Gladden-Green, Americas strategic marketing manager for TI´s wireless terminals business unit, assesses the rollout of new mobile entertainment services in the United States.
- "Device Capabilities," 3:30 p.m., Tuesday, March 18, Room 272 Tom Pollard, worldwide wireless terminals chipset marketing director, discusses the user interface challenges associated with today´s wireless devices, such as battery life, processing power, user interface and overall form factor.
- "WLAN, Bluetooth and 3G: What´s Next...What´s Now," 8:30 a.m., Thursday, March 20, Room 208-210 Alain Mutricy, TI vice president and worldwide OMAP platform general manager, discusses the co-existence of these leading wireless technologies.
- "Key Technologies Enabling Success of Wi-Fi Public Access Networks," 9:30 a.m., Thursday, March 20, Room 215 Paul Struhsaker, CTO of TI´s wireless LAN business unit, reveals what needs to happen to enable mainstream acceptance and the ultimate success of public access Wi-Fi networking.
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