Agilent Technologies' IC Test Solution to Test CIDC Smart Card ICs

3/14/2003 - China Integrated Circuit Design Centre (CIDC), China's first commercial IC design company, has selected the Agilent Versatest Series Model V3300 contactless smart card integrated circuit (IC) solution to test a new series of contactless smart card ICs that will be used in transportation, banking and identification applications.

"CIDC has long dedicated itself to providing China with the most advanced smart card IC products, as China is growing to become one of the world's largest smart card IC markets," said Zhang Hui-Quan, CEO of CIDC and secretary chief of China Semiconductor Business Association Design Branch. "I am pleased with Agilent's dedication in delivering the testing solutions that fulfill the present and future test needs in this emerging market."

CIDC is one of the four major contactless smart card IC design houses in China, supporting government's strategy for nation-wide contactless smart card applications. Agilent's Model V3300 maximizes the value provided to CIDC, meeting the testing requirements of high-speed data processing and security. The newly introduced CIR7101 ICs are in compliance with international standards ISO 1443 types A and B for contactless cards.

"China is an emerging market with strong demand for contactless smart card chips. The key success factor in this market is cost-effective RF test solutions to test these contactless smart card chips," said Xiao Gang, CIDC senior engineer and Testing Department manager. "We are pleased that Agilent has developed a cost-effective solution to test up to 16 devices in parallel without compromising test performance. Agilent also collaborates with CIDC, providing support for our semiconductor test professionals."

"The seamless introduction of CIDC contactless smart card again demonstrates Agilent's commitment to help China customer succeed," said Paul Yang, general manager of Agilent's China Semiconductor Test business. "Our worldwide testing experience enables China customers to overcome special testing challenges in order to meet their production volume requirements and get their products into the market quickly, at the lowest cost of test."

The V3300 is a high-throughput, eight-site system, capable of testing up to 64 ICs at once, as well as up to 128 pin-count devices. It is designed to address both the needs of non-volatile memory and mixed memory/logic device manufacturers. Its innovative tester-per-site architecture allows each site to be tested independently with its own set of resources. Furthermore, the V3300's new radio frequency (RF) module provides a solution for cost-effective test of any type of smart card ICs.

More information about the Agilent Versatest Series Model V3300 contactless smart card solution is available at

Agilent is demonstrating the Smart Card IC test solutions of the Model V3300 at SEMICON China, booth no. 2115.

More information about Agilent's semiconductor test products is available at

About China Integrated Circuit Design Centre (CIDC)
CIDC, a subsidiary of China Electronics Corporation (CEC), was founded in 1986. China's first specialized IC design house, it has grown to produce over 100 million yuan worth of ICs per year. The "Panda system" it developed in the 1990s is still China's only self-developed IC design software IP package and is used by a number of domestic and foreign design firms. CIDC has designed ICs for smart card, digital imaging, networking, ASIC and SOC applications. For more information, please visit

About Agilent Technologies
Agilent Technologies Inc. (NYSE: A) is a global technology leader in communications, electronics and life sciences. The company's 35,000 employees serve customers in more than 110 countries. Agilent had net revenue of $6 billion in fiscal year 2002. Information about Agilent is available on the Web at

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