Samsung Tests Combi-smartcards with Agilents' Smart Card IC Solution

3/6/2003 - Agilent Technologies Inc. (NYSE: A) announced that Samsung Electronics, a world-leading integrated device manufacturer, has selected the Agilent Versatest Series Model V3300 contactless smart card integrated circuit (IC) solution to test combi-smartcards for use in transportation, banking and identification applications. Agilent's smart card test solution is the product of close collaboration between Agilent and Samsung test engineers, who optimized the product for Samsung's specific test needs.

Combi cards, which utilize a single IC to integrate both contact cards that must be inserted into an electronic reader and contactless cards that are embedded with a radio frequency (RF) antenna and need no reader, are in high demand.

The optimized Model V3300 contactless smart card IC RF solution fulfills Samsung's needs by meeting the high-speed data processing requirements of transportation cards and the security needs of banking cards. The contactless smart card test solution also tests Samsung's combi card ICs for compliance to ISO 1443 types A and B, key international standards for contactless cards.

"In the past, there was no cost-effective RF test solution for contactless smart card chips due to the low profit margin of contactless smart card in the semiconductor testing market. We are pleased that Agilent and Samsung co-developed a cost-effective solution to test up to 16 devices in parallel without comprising test performance," said Tae-Woo Kwon, test manager, Samsung. "On top of satisfactory cost-of-test performance, the Agilent Korea team also provided us with the best engineers to help get our product into mass production in a very short time."

"The Agilent Versatest Series Model V3300 contactless smart card RF solution enables Samsung to meet their cost-of-test goals for volume production of their new combi card ICs," said Yong-Sun Lee, service and support manager of Agilent's Korea and China Semiconductor Test business. "This collaboration represents Agilent's commitment to helping Samsung overcome special testing challenges in order to meet its production volume requirements throughout the company's broad range of products."

The V3300 is a high-throughput, eight-site system, capable of testing up to 64 ICs at once. It is designed to address both the needs of non-volatile memory and mixed memory/logic device manufacturers. Its innovative tester-per-site architecture allows each site to be tested independently with its own set of resources. In addition, the V3300's new radio frequency (RF) module provides a solution for cost-effective test of any type of smart card ICs.

More information about the Agilent Versatest Series Model V3300 contactless smart card solution is available at

V3300 Demonstration at Semicon China 2003
Agilent is demonstrating the smart card IC test solutions of the Model V3300 at Semicon China, booth no. 2115.

About Samsung Electronic Co., Ltd.
Samsung Electronics Co. Ltd. is a global leader in semiconductor, telecommunication, and digital convergence technology. Samsung Electronics employs approximately 64,000 people in 89 offices in 47 countries. Samsung Electronics is the world's largest producer of memory chips, Smart Card Chips, Display Driver ICs, TFT-LCDs, CDMA mobile phones, monitors and VCRs. Samsung Electronics consists of four main business units: Digital Media Network, Device Solution Network, Telecommunication Network and Digital Appliance Network Businesses. For more information, please visit the web site,

About Agilent Technologies
Agilent Technologies Inc. (NYSE: A) is a global technology leader in communications, electronics and life sciences. The company's 35,000 employees serve customers in more than 110 countries. Agilent had net revenue of $6 billion in fiscal year 2002. Information about Agilent is available on the Web at

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