HyperTransport Compatibility Program Launched

2/6/2003 - The HyperTransport Consortium announced a new HyperTransport Technology Compatibility Program designed to facilitate industry-wide use of the HyperTransport chip-to-chip interconnect specification. The new Compatibility Program consists of a set of electrical and protocol checklists and a Device Under Test Connector definition that HyperTransport-enabled product manufacturers can use to help ensure compatibility between their devices.

“This new program is an essential step for the HyperTransport industry,” states Gabriele Sartori, President of the HyperTransport Technology Consortium. “This program gives users and designers a means of comparing HyperTransport-enabled devices with the ultimate aim of ensuring that products from one manufacturer will easily integrate with others. By precisely defining a list of interoperability tests that check that a given implementation meets the stringent requirements of the HyperTransport specification, the checklists give manufacturers a valuable set of tools to help them produce interoperable parts.”

The HyperTransport Consortium Infrastructure Task Force developed the HyperTransport Compatibility Program. “We worked with member companies to define exactly what was needed in the Compatibility Program,” states Todd Hironaka, Chair of the HyperTransport Infrastructure and Senior Hardware Engineer, Technology Center, Cisco Systems. “This is an important first step to ensure system designers can reliably apply HyperTransport technology regardless of the product source.”

Adds Brian Holden, Principal Engineer in PMC-Sierra’s MIPS Processor Division and Chair of the HyperTransport Technology Consortium Technical Working Group, “As HyperTransport technology proliferates, the need for interoperability testing grows ever more important. The release of these checklists and the Device-Under-Test Connector definition are key first steps for our technology. During 2003, we plan to develop further technical specifications that will add to the security of users and make it easier for manufacturers to compete for HyperTransport-enabled sockets.”

The HyperTransport Technology Compatibility Program consists of a set of electrical and protocol checklists and a Device-Under-Test definition, available to members of the HyperTransport Consortium at www.hypertransport.org. Consortium members can use these checklists and the test connector definition to test their products against the various levels of specifications of the HyperTransport technology. The current specification release is 1.05.

About HyperTransportTM Technology
HyperTransport universal chip-to-chip interconnect technology replaces and improves upon existing multilevel buses used in systems such as personal computers, servers and embedded systems while maintaining software compatibility with PCI I/O technologies. HyperTransport technology delivers a maximum 12.8 GB/second aggregate bandwidth using easy to manufacture dual, unidirectional point-to-point links. Enhanced 1.2V low-power LVDS signaling and dual-data rate data transfers deliver increased data throughput while minimizing signal crosstalk and EMI. HyperTransport interconnect technology employs a packetized data protocol to eliminate many sideband signals (control and command signals) and supports asymmetric, variable width data paths.

About the HyperTransportTM Technology Consortium
The HyperTransport Technology Consortium is a non-profit organization managed by its members that is dedicated to promoting HyperTransport technology as an open, freely available industry specification for high bandwidth chip-to-chip communications. Membership in the consortium is open to any industry participant for a modest administrative fee and includes the rights to royalty-free use of HyperTransport technology Intellectual Property. More information can be obtained from the HyperTransport Technology Consortium website at www.hypertransport.org. Advanced Micro Devices, Alliance Semiconductor, Apple Computer, Broadcom Corporation, Cisco Systems, NVIDIA, PMC-Sierra, Sun Microsystems, and Transmeta are promoter members and comprise the Executive Committee of the HyperTransport Technology Consortium.

Companies interested in HyperTransport technology are invited to join the consortium. Consortium members pay modest annual dues and receive a royalty-free license to use HyperTransport IP, gain access to additional technical documentation and may attend consortium meetings and events. To become a member, visit the consortium Web site at www.hypertransport.org.

HyperTransport is a trademark of the HyperTransport Technology Consortium.

Previous Page | News by Category | News Search

If you found this page useful, bookmark and share it on: