Fujitsu Microelectronics Unveils Evaluation Device for ARM9 Multi-CPU

12/1/2003 - Fujitsu Microelectronics America, Inc. (FMA) introduced a new ARM9 multi-CPU evaluation device, the MB87Q1100, as part of a platform developed to enable customers to design large, complex systems with very high levels of predictability and efficiency. The MB87Q1100 integrates the ARM926EJ-S and ARM946E-S embedded macrocell cores in Fujitsu's next-generation System-on-Chip (SoC) platform.

A versatile chip built using Fujitsu's 0.11-micron CMOS technology, the MB87Q1100 provides a high-performance processor sub-system with excellent correlation to the expected performance from other SoC designs. The platform adopts multi-CPU capabilities, and its multi-layer Advanced High-performance Bus (AHB) improves throughput and reduces power consumption significantly, to a typical 450mW at CPU operation of 200MHz.

The platform also incorporates the external extension function of AHB-Lite, a subset of the AHB system bus, so customers can design and verify modules in their ASICs by connecting the master and slave module of AHB-Lite to the device.

"The new ARM9 evaluation device will improve efficiency, shorten customer development times, and enable very complete final chip solutions," said Ray Abrishami, senior director of SOC engineering for Fujitsu Microelectronics America. "Customers will gain the benefits of a seamless development environment that will allow them to reduce design cycle times significantly. The new platform represents the next major milestone in Fujitsu's commitment to the growing SoC market and to the evolving demand for system-emulation environments that support cost-effectiveness and predictability."

A T-Engine, an open, real-time, standard networking development platform board for mobile and digital consumer products incorporating the MB87Q110, was demonstrated at the Embedded Technology 2003 (ET2003) show in Yokohama, Japan. Fujitsu expects to deliver this T-Engine board as a development environment for various SoCs for embedded applications at the end of 2003.

Packaged in a 400-pin FBGA, the MB87Q1100 samples will be available in December as part of the new SoC platform at U.S. $230 each in 1,000-unit quantities.

Key features include the following:

  • FBGA400 (15 x 15mm)
  • Multi-CPU (ARM926EJ-S/ARM946E-S)
  • Multi-layer AHB
  • Frequency of operation (worst-case): CPU 200MHz, AHB 100MHz, APB 50MHz
  • Power consumption: 450mW (typical at 200MHz CPU operation)
  • ARM926EJ-S, ARM946E-S. Cache size: 16kB/16kB. TCM size: 64kB/32kB
  • Built-in peripherals:
    • Flash and SDRAM memory controller
    • Eight-channel DMA (Direct Memory Access) controller
    • Power-saving mechanism (a clock gear function, standby mode)
    • Interrupt controller
    • 2 channel UART
    • 2 x 2 channel timer
    • GPIO

About Fujitsu Microelectronics America
Fujitsu Microelectronics America, Inc. (FMA) leads the industry in innovation. FMA provides high-quality, reliable semiconductor products and services for the networking, communications, automotive, security and other markets throughout North and South America. For product information, visit the company web site at http://www.fma.fujitsu.com/asic

ARM is a registered trademark of ARM Limited.

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