Sun, TI to Reduce Cost, Complexity of Deploying Mobile Java Services

10/31/2003 - To help mobile device manufacturers and wireless operators reduce the cost and complexity of deploying mobile data services, Sun Microsystems, Inc. (Nasdaq: SUNW) and Texas Instruments Incorporated (TI) [NYSE: TXN] are working together to deliver optimized end-to-end wireless solutions for 2.5G and 3G networks in the second quarter of 2004. This initiative marks the beginning of a collaboration that will help increase demand for converged voice and multimedia wireless devices, creating revenue-generating opportunities for OEMs, wireless operators and applications developers.

"Widespread deployment of compelling new applications based on open standards-based platforms will drive consumer demand for 2.5G and 3G wireless handsets and services," said Rick Kornfeld, vice president and general manager of TIīs Wireless Chipset Business Unit. "We are pleased to work with Sun to accelerate the growth of the wireless market via complete, end-to-end Java solutions and optimized Java technology for TIīs TCS wireless chipsets and OMAPTM applications processors."

As part of this collaboration, TI licensed Sunīs Connected Limited Device Configuration HotSpotTM Implementation (CLDC HI) for integration into its family of TCS chipsets for GSM/GPRS, EDGE, CDMA and UMTS-enabled handsets and wireless OMAP applications processors in an effort to reduce the complexity of JavaTM technology-enabled handset production and to ensure an enhanced consumer experience. TI expects to offer complete GPRS chipsets and handset reference designs including Sunīs CLDC HI by the second quarter of 2004.

Sun and TI also are working together to provide an optimized implementation of Mobile Information Device Profile 2.0 (MIDP 2.0) on TI's TCS wireless chipsets and OMAP processors. These joint efforts will simplify the design of optimized, Java technology-enabled devices, thus reducing development costs and time-to-market for mobile device manufacturers. The optimized implementation of MIDP 2.0 that interoperates with CLDC HI on TI's OMAP platform is expected to be available from Sun by the second quarter of 2004.

The two companies plan to validate the optimized Java implementation on the OMAP platform with Sunīs Content Delivery Server to reduce the complexity for mobile operators in the deployment of Java technology-based mobile data services. The combination of Sunīs Java Mobility Advantage ProgramTM and the SunTM Content Delivery Server with TIīs TCS wireless chipsets, OMAP application processors and reference designs will provide a high performance, integrated, end-to-end solution for the deployment of Java applications and services.

"Mobile device manufacturers and wireless operators recognize Java as a leading technology that delivers value in the development and deployment of mobile data services. Together, Sun and TI will provide new revenue-generating opportunities for OEMs, wireless operators and developers by enabling a broad range of Java applications and content to accelerate the deployment of Java technology-enabled handsets and services," said Alan Brenner, vice president of Sun's Consumer and Mobile Systems Group. "Beyond this collaboration, we plan to work with TI on future projects that will enable more exciting Java content across different handset markets."

Sun has recently announced that the shipment of mobile Java devices exceeded the 120 million-unit milestone. Factors contributing to this milestone include the availability of more than 200 different Java technology-enabled handsets through more than 70 carriers worldwide, a growth of 35 percent since June.

Texas Instruments - Making Wireless
TI is the leading manufacturer of wireless semiconductors, delivering the heart of todayīs wireless technology and building solutions for tomorrow. TI provides a breadth of silicon and software and 15 years of wireless systems expertise that spans handsets and base stations for all communications standards, wireless LAN, Bluetooth and Ultra Wideband. From custom to turn-key solutions, including complete chipsets and reference designs, OMAP application processors, core digital signal processor and analog technologies built on advanced semiconductor processes, TI is making wireless personal, intelligent and seamless.

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