White Electronic Rolls Out 2Mx32 SRAM Multi-Chip Package

10/31/2003 - White Electronic Designs Corporation (NASDAQ:WEDC) expands their SRAM Multi-Chip portfolio with the release of the 2Mx32 SRAM Multi-Chip Package. This module provides unprecedented density for single chip Asynchronous SRAM memories.

The 255 plastic ball grid array module is organized as 2Mx32, features access times of 12, 15, 17 20ns and measures only 25mm x 25mm. The module utilizes 3.3V operation, three state output, TTL compatible I/O, low power CMOS and fully static operation. The SRAM, designated W82M32V-XBX, is suitable for high-reliability COTS (Commercial-Off-The-Shelf) applications and is available in commercial, industrial and military temperature ranges.

Pricing and Availability
Whites 2M x 32 SRAM Multi-Chip Package, part number W82M32V-XBX, is priced at $250.00 (US) each with a minimum quantity of 1,000 and a lead-time of 4-6 weeks.

About White
White Electronic Designs Corporation designs, develops and manufactures innovative solutions for three high technology sectors in military, industrial and commercial markets; advanced semiconductor packaging, high-density memory products and state-of-the-art microelectronic multi-chip modules for data communications and telecommunications providers, defense and aerospace system suppliers; ruggedized high-legibility flat panel display for commercial/military aircraft and ordnance delivery systems; interface storage and retrieval devices, and electromechanical assemblies for OEM's in commercial and military markets. White is headquartered in Phoenix, Arizona and has design and manufacturing centers in Arizona, Indiana, Oregon and Ohio. To learn more about White Electronic Designs, visit our web site at www.whiteedc.com.

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