10/10/2003 - Atmel® Corporation (Nasdaq: ATML) announced that its foundry service is also available for its high-voltage BCD-on-SOI technology. The new BCD-on-SOI process, called SMARTIS, combines bipolar, CMOS and DMOS technology. This enables simultaneous handling of analog and digital power to realize devices that combine power drivers and small microcontroller cores on one chip. These so-called smart power devices serve for a broad range of automotive, telecommunications, industrial and consumer electronics.
The benefits of the SMARTIS technology, significant chip size reduction in comparison to bulk technology, improved EMC features, reduced standby current and latch-up effects make this process highly efficient and very attractive for a broad range of high-volume applications such as motor drivers, power management systems, 42-V automotive board network, digital audio amplifiers, and ADSL physical devices. One example is a kitchen stove supervisory sensor able to operate up to 200 degrees Celsius.
SMARTIS is based on a 20-mask process with 80-V breakdown voltage. With an average gate density of 4000 gates/ sqmm, this new technology is ideal for system-on-chip designs. This technology enables circuit designs with the required extended junction temperature of up to 200 degrees Celsius and with true highside switches. Compared to bulk BCDMOS, the on-resistance of the driver stages is reduced by about 30%. The influence of parasitic effects is also drastically reduced. In contrast to the standard BCDMOS process, the PN-junction isolation is replaced by oxide isolation for improved device characteristics.
To enable easy design-in, Atmel offers a Starter Kit and a Cadence Design Kit. The Design Kit supports the entire IC design flow: accurate mixed-signal simulation of digital and analog circuits, layout generation and circuit verification.
To get easy access to Atmel's foundry service, customers can participate in a Multi-Project Wafer (MPW) at a fixed cost.
Atmel operates 5 wafer manufacturing facilities using leading-edge technologies. Its extensive manufacturing is also made available to customers who want to access silicon foundry for their products. In addition to BCD-on-SOI, Atmel's foundry service includes state-of-the-art production lines for CMOS NVM, BiCMOS, Bipolar and Silicon Germanium (SiGe) technologies that benefit from Atmel's strong experience in statistical methods and manufacturing tools.
Further information on Atmel's BCDMOS Foundry offer and Starter Kit as well as Design Kit can be obtained via firstname.lastname@example.org.
BCD-on-SOI = Mix technology combining Bipolar, CMOS, and DMOS elements on Silicon on Insulator
EMC = ElectroMagnetic Compatibility
MPW = Multi-Project Wafer
SiGe = Silicon Germanium
NVM = Nonvolatile Memory
Founded in 1984, Atmel Corporation is headquartered in San Jose, California with manufacturing facilities in North America and Europe. Atmel designs, manufactures and markets worldwide, advanced logic, mixed-signal, nonvolatile memory and RF semiconductors. Atmel is also a leading provider of system-level integration semiconductor solutions using CMOS, BiCMOS, SiGe, and high-voltage BCDMOS process technologies.
Atmel® and combinations thereof are the registered trademarks of Atmel Corporation or its subsidiaries. Cadence® is a trademark of Cadence Design Systems, Inc.
Atmel's BCD-on-SOI information may be retrieved at: http://www.atmel.com/products/BCDSOI
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