Teradyne to Provide High Performance Circuits to Kaparel Corporation for High-Speed Backplane Applications

1/22/2003 - Teradyne, Inc. (NYSE: TER) Connection Systems Division (TCS), a leading provider of high performance connectors, circuits, and electronic manufacturing services, and Kaparel Corporation, a leader in high-speed backplane technology, announced they have formed a supply partnership for high-performance circuits (HPC).

"Standard backplanes, such as CompactPCI, VME, and the introduction of switch fabrics, are becoming increasingly complex as chip technology and density increases," said Tom Sutherland, General Manager, Kaparel Corporation. "Teradyne’s leadership in high-volume fabrication of complex high performance printed circuits will help us to meet the growing technology requirements of our customers."

Under terms of the agreement, Teradyne will provide Kaparel with open standard printed circuit boards for their backplane designs. The two companies will also participate in a technology exchange that will improve printed circuit board design for use with open standards, such as PICMG 3.0.

"We are excited about the partnership, as this continues to leverage each company’s core competencies and technology," said Leigh Eichel, marketing manager for Teradyne’s printed circuit business unit. "Kaparel’s expertise in high speed printed circuit board layout is a perfect fit with our own engineering and manufacturing capabilities. Moreover, as a Tier A HPC supplier, Teradyne will ensure a continuity of supply combined with a relentless focus on quality for Kaparel’s most demanding customers."

Teradyne’s high performance printed circuit board capabilities include prototype through production volume manufacturing of panel sizes up to 24" x 54", .050" to .500" thick, deep micro via technology, and layer counts from 6 to 60. Kaparel specializes in high slot count, hot swap and high availability systems and has a complete line of standard off-the-shelf products and specializes in custom solutions.

"The global design community will greatly benefit from the combination of Teradyne's and Kaparel's world class engineering expertise," said Robert Cutler, high-speed signal integrity expert for RDC Consulting. "As data rates across backplanes push to 10+ gigabits per second, the kind of higher level engineering both companies bring to the table becomes critical to success."

About Teradyne Inc.
Teradyne (NYSE: TER) delivers solutions for testing and connecting electronics. It is the world's leading supplier of automatic test equipment for testing semiconductors, circuit boards and modules, vehicle diagnostics and voice and broadband telephone networks. Teradyne is also a leader in total system solutions, providing a broad range of technology-focused products and services, including high-speed, high-density connectors, high-performance circuits, backplane assembly and complete systems integration and test. The company had sales of $1.22 billion in 2002 and currently employs about 7200 people worldwide. For more information visit www.teradyne.com.

Kaparel Corporation
Kaparel is an ISO 9001:2000 registered company that develops, manufactures, and globally markets high-speed backplane solutions to the Converging Communications market. From its pioneering work in CompactPCIÒ bridge designs, Kaparel has quickly become a leader in many aspects of high-speed backplane architecture technology (www.kaparel.com).

Kaparel specializes in high slot count, hot swap and high availability systems and has custom designed over 250 high-speed and CompactPCI backplanes for major global telecommunications and computer manufacturers. Founded in 1996 (as the cPCI division of PixStream Incorporated), Kaparel is based in Canada’s Technology Triangle in Waterloo, Ontario and is a part of Rittal International (www.rittal.com), the world’s largest electronic enclosure manufacturer with offices in over 55 countries.

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