Solderless Socket Allows BGA Die Probing with Picoprobes at GHz Operating Speeds

9/13/2002 - Ironwood Electronics’ new high performance probing Socket, the SG-BGA-6054 allows probing of an integrated circuit Die in a BGA package with Picoprobes from GGB Industries. A small access cavity on top of the ZIF socket allows access to the die for exact location probing. The socket accommodates the interconnection of a 15mm, 0.8mm pitch, 17X17 BGA IC. The socket is a precision device, which guides the IC to the exact position for connection of each ball and uses four symmetrically placed screws to provide compressive force. The socket handles high-speed signal bandwidth up to 6.5 GHz. Minimal extra real estate of 2.5 mm per side larger than the IC is required for the socket. The user installs the socket base, inserts the IC and socket lid, tightens the compression screws, and can then begin GHz bandwidth Picoprobe analysis on the exposed die.

Pricing for the sockets SG-BGA-6054 is $358 at quantity 100. More info:

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