8/5/2002 - Data Device Corporation (DDC) is expanding its Enhanced Mini-ACE MIL-STD-1553 component offering with the introduction of a ball grid array (BGA) package referred to as the Micro-ACE (µ-ACE). This new package has the smallest footprint of any 1553 integrated terminal in the industry and is the first of its kind offered in a BGA package.
"When you're designing components for military and avionics systems, keeping it small has many advantages" noted Todd Decker, Data Bus Marketing Manager at DDC. "Designers have only so many square inches to work with and going from a one-inch-square gull lead package to a 0.8-inch-square BGA requires 35% less real estate on the card opening up possibilities for multiple 1553 channels and other high density applications. As you'd expect, this small component is also lighter weight."
The BGA packaging is available in three µ-ACE configurations:
All three µ-ACE devices feature the full range of architectural advancements found in DDC's Enhanced Mini-ACE products, including a highly autonomous BC, a choice of RT buffering modes, a selective message monitor; a highly autonomous built-in protocol and RAM self-test; and a choice of 10, 12, 16 or 20MHz clock frequencies. Furthermore, Micro-ACE products are compliant with MIL-STD-1553A/B; STANAG 3838 and MIL-STD-1760.
DDC's BGA product is a plastic molded device built on FR4 material that matches the temperature coefficient of all PC boards. "This means our product will expand and contract at the same rate as the PC board to which it's attached, resulting in a mechanically reliable assembly," said Len Marro, Vice President of Engineering at DDC. "These Micro-ACE models are the industry's smallest MIL-STD-1553 terminals; rated to operate over industrial temperatures (?40°C to +85°C) and are impervious to moisture," he added.
Amir Massumi, Director of Marketing at DDC stated, "DDC has designed the Micro?ACE product line to be competitively priced for all applications, and is especially economical when purchased in large quantities."
Data Device Corporation is an international leader in high-reliability data conversion interface components and subsystems for military, commercial, and industrial applications. Established in 1964 with the introduction of the first synchro-to-digital module, DDC has design and manufacturing facilities in their Bohemia, New York headquarters and in Cork, Ireland.
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