8/5/2002 - 3DSP, the leader in configurable digital signal processor (DSP) architectures, announced the availability of a comprehensive platform for the implementation of high quality audio applications. The platform includes an enhanced software suite for AC-3, MP3, AAC and MPEG 1 and 2 audio encode and decode standards. The audio software is targeted to run on the company's high performance 32-bit DSP cores for the highest audio quality available.
Along with the software suite, 3DSP offers a hardware development system using the company's available SP-5D DSP development chip. The chip is a pre-integrated subsystem with an embedded DSP core and a complete set of system interfaces and peripheral components. This development system provides a GUI-based software and hardware development environment. Demonstration versions of the audio decoder algorithms and other audio algorithms that run in real time on the development system are also available.
3DSP's audio solution enables system designers to add performance-demanding audio post processing with its scalable architecture. In addition, the configurable core allows implementation in 0.13 m process for a minimal die size of 9 mm with power consumption of only 12 milliwatts (mW). In this low-power, low-voltage process the processor can run as fast as 200 Megahertz (MHz). The real-time software implementation of MP3 can be performed at 13 Megahertz, compared with competitive solutions that typically require greater than 24 MHz. This low MIPs utilization allows multi-standard implementations and multi-function chips to be designed using a single high performance DSP core.
"Our enhanced audio platform offers best-in-class performance coupled with the ability to handle the full complement of audio formats and post-processing capabilities," said Kan Lu, CTO at 3DSP. "Such a comprehensive product has attracted several customers such as Sony, ATI and Syntek and will provide them with a superior fast time-to-market, low-risk solution."
About 3DSP (www.3dsp.com)
3DSP offers the industry's only fully configurable digital signal processing architecture with a comprehensive object-oriented design environment and application-based intellectual property. 3DSP's technology empowers system designers to create custom SoC solutions in silicon that achieve significant competitive advantages in terms of performance, integration, power consumption, cost and time-to-market for tomorrow's multimedia, wireless and Voice over Packet applications.
SP-5D, SP-5, 3DSP Corporation and 3DSP are trademarks of 3DSP Corporation.
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