7/19/2002 - California Micro Devices (Nasdaq: CAMD) today announced that cumulative shipments of its chip scale packaged (CSP) products for mobile electronic applications have achieved a significant milestone of 20 million units shipped through June 30, 2002. Based upon widespread design adoption of its recently introduced family of six new CSP devices that integrate electromagnetic interference (EMI) filters and electrostatic discharge (ESD) protection, the company has quickly ramped volume production and established CSP production capabilities to support the continued demand growth for these products. In doing so, California Micro Devices has moved into a leadership position in the industry's expected transition to highly integrated, minimum form factor, application specific integrated passive (ASIPTM) solutions for wireless handsets and other mobile electronic devices.
Reduced Size, Increased Integration
By definition, a CSP device measures no more than 1.2x the size of the die it contains. California Micro Devices CSP products offer a 1x package-to-die ratio in that the packaged device has the same footprint as the die. The company's CSP technology combines proprietary thin-film processes with UltraCSPTM , technology, a wafer bumping and re-distribution process licensed from the Flip Chip Technology division of Kulicke & Soffa. The chip is attached face down to the printed circuit board using solder bumps as interconnects, which improves the filter performance by eliminating the parasitic effects of wirebonds and lead frames, making California Micro Devices CSP the ideal solution for high frequency applications.
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